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James Maurus Phones & Addresses

  • 6225 Perry Ave, Auburn, WA 98092 (253) 887-7949 (253) 229-1126
  • Sumner, WA
  • 926 Bryant Ave, Chico, CA 95926 (530) 879-0879 (707) 836-1520
  • 52 Forest Creek Cir, Chico, CA 95928 (530) 879-0879
  • 650 Decanter Cir, Windsor, CA 95492
  • 312 5Th St NW, Puyallup, WA 98371
  • Santa Rosa, CA
  • Lafayette, CA

Publications

Us Patents

Airflow Heat Dissipation Device

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US Patent:
7814965, Oct 19, 2010
Filed:
Nov 20, 2006
Appl. No.:
11/602684
Inventors:
Michael Spokoiny - Chico CA, US
James M. Kerner - Chico CA, US
Xinliang Qiu - Chico CA, US
Craig J. Lux - Chico CA, US
James W. Maurus - Sumner WA, US
Assignee:
United States Thermoelectric Consortium - Chico CA
International Classification:
F28F 7/00
H05K 7/20
US Classification:
165 803, 165 804, 16510433
Abstract:
Airflow-based heat dissipation is described. A heat sink includes a housing with a first chamber and a second chamber separated by an interface located below the first chamber. The first chamber has sidewalls with first side ports and an access opening. Pins extend from a top surface of the interface into the first chamber. The top surface of the interface has dimples located between the pins and first passageways which extend from the dimples of the top surface to a bottom surface of the interface. The second chamber has a network of tunnels with ends that extend to the sidewalls to provide second side ports. The first passageways extend to the network of tunnels.

Fluid-Operated Heat Transfer Device

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US Patent:
7992625, Aug 9, 2011
Filed:
Aug 18, 2006
Appl. No.:
11/506726
Inventors:
Michael Spokoiny - Chico CA, US
James M. Kerner - Chico CA, US
Xinliang Qiu - Chico CA, US
James W. Maurus - Chico CA, US
Boris M. Spokoyny - Chico CA, US
Assignee:
United States Thermoelectric Consortium - Chico CA
International Classification:
F28F 7/00
H05K 7/20
US Classification:
165 804, 16510433
Abstract:
Method and apparatus for heat transfer are described. In particular, a heat transfer device includes a housing having input and output ports for ingress and egress of a medium. The housing defines an interior volume with a first portion having pins extending therein and a second portion defined in part by a network of micro-channels. An interface between the first portion and the second portion of the interior volume has orifices for providing passageways for flow of the medium therebetween. A first portion of the pins are spaced apart from the interface to promote generation of vortices of the medium in the first portion of the interior volume.

Heat Dissipating Device

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US Patent:
20060231236, Oct 19, 2006
Filed:
Oct 27, 2005
Appl. No.:
11/262301
Inventors:
Michael Spokoiny - Chico CA, US
James Kerner - Chico CA, US
Craig Lux - Chico CA, US
James Maurus - Chico CA, US
International Classification:
H05K 7/20
US Classification:
165080400, 165109100
Abstract:
A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.
James W Maurus from Auburn, WA, age ~68 Get Report