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James L Cabernoch

from Altadena, CA
Age ~83

James Cabernoch Phones & Addresses

  • 2880 Stonehill Dr, Altadena, CA 91001 (626) 529-5331
  • 9129 Madison Ln, Santa Clarita, CA 91310
  • Castaic, CA
  • Wentzville, MO
  • Flagstaff, AZ
  • Pasadena, CA
  • Los Angeles, CA
  • Marine, IL

Publications

Us Patents

Glucose Sensor Package System

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US Patent:
6360888, Mar 26, 2002
Filed:
Feb 10, 2000
Appl. No.:
09/501848
Inventors:
K. Collin McIvor - Claremont CA
James L. Cabernoch - Santa Clarita CA
Kevin D. Branch - Northridge CA
Nannette M. Van Antwerp - Valencia CA
Edgardo C. Halili - Valencia CA
John J. Mastrototaro - Los Angeles CA
Assignee:
Minimed Inc. - Northridge CA
International Classification:
B65D 8538
US Classification:
206305, 206306, 206438, 206363, 2064591, 600347, 600345, 600365
Abstract:
A glucose sensor package system that includes a glucose sensor and a protective package that indicates exposure to temperature changes to indicate proper temperature control. Also covered are methods of transporting and sterilizing the package. In addition, glucose sensors directed to various sizing and positioning of the electrodes on the glucose sensor are covered.

Glucose Sensor Package System

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US Patent:
6520326, Feb 18, 2003
Filed:
Oct 9, 2001
Appl. No.:
09/973852
Inventors:
K. Collin McIvor - Claremont CA
James L. Cabernoch - Santa Clarita CA
Kevin D. Branch - Northridge CA
Nannette M. Van Antwerp - Valencia CA
Edgardo C. Halili - Valencia CA
John J. Mastrototaro - Los Angeles CA
Assignee:
Medtronic MiniMed, Inc. - Northridge MA
International Classification:
A61B 502
US Classification:
206305, 600345, 600365, 600347, 422 1, 422 22, 206438, 206363, 2064591
Abstract:
A glucose sensor package system that includes a glucose sensor and a protective package that indicates exposure to temperature changes to indicate proper temperature control. Also covered are methods of transporting and sterilizing the package. In addition, glucose sensors directed to various sizing and positioning of the electrodes on the glucose sensor are covered.

Glucose Sensor Package System

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US Patent:
6892085, May 10, 2005
Filed:
Nov 26, 2002
Appl. No.:
10/304518
Inventors:
K. Collin McIvor - Claremont CA, US
James L. Cabernoch - Santa Clarita CA, US
Kevin D. Branch - Northridge CA, US
Nannette M. Van Antwerp - Valencia CA, US
Edgardo C. Halili - Valencia CA, US
John J. Mastrototaro - Los Angeles CA, US
Assignee:
Medtronic MiniMed, Inc. - Northridge CA
International Classification:
A61B005/05
A61B005/00
A61B005/04
US Classification:
600347, 600345, 600365, 600372
Abstract:
A glucose sensor package system that includes a glucose sensor and a protective package that indicates exposure to temperature changes to indicate proper temperature control. Also covered are methods of transporting and sterilizing the package. In addition, glucose sensors directed to various sizing and positioning of the electrodes on the glucose sensor are covered.

Thermoplastic Containers With Easy Access Defined By Laser-Induced Rupturable Areas

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US Patent:
20110240644, Oct 6, 2011
Filed:
Apr 4, 2011
Appl. No.:
13/079212
Inventors:
Steven Donald Kimmell - Simi Valley CA, US
Arthur Barukh - Simi Valley CA, US
James Louis Cabernoch - Altadena CA, US
Glenn Roy Detlor - Monument CO, US
International Classification:
B65D 41/32
B29C 35/08
B29C 51/00
US Classification:
220266, 264400
Abstract:
A thermoformed or vacuum-formed plastic container packaging including a laser energy-induced internal rupturable area disposed between the topside and the bottomside of the plastic material. A pattern in structural communication with the laser-induced rupturable area enables the user's hands to apply a focused shearing force on the area for fracturing and opening the plastic material container. The rupturable area is configured such that an exerted shearing force exposes a haptically smooth fractured edge to the user. Two rupturable areas may be disposed such that two parallel patterns configure a tear strip or a pull-tab. Multiple rupturable areas are disposed such that parallel and attachable patterns configure protective covers or tear strip ends. Die cutout patterns configure notches or voids attached to said laser-induced rupturable area.
James L Cabernoch from Altadena, CA, age ~83 Get Report