US Patent:
20120298226, Nov 29, 2012
Inventors:
Jake Jared Struempler - Anchorage AK, US
International Classification:
F16L 41/00
Abstract:
A heating/cooling manifold is presented. The manifold includes a first segment configured to vertical mount to a surface. The first segment comprises a first end and a second end, each comprising a coupling configured to releasably attach to a second segment; and between 2 and 4 ports disposed along the length of the first segment. The spacing between adjacent ports is less than 4 times an interior diameter of the first segment. The manifold further includes a second segment releasably attached to the first segment.