Inventors:
Richard K. Schmid - Gerlikon, CH
Jacobus C. Doesburg - Westbury NY, US
Assignee:
Sulzer Metco (US), Inc. - Westbury NY
International Classification:
B23K 35/24
B22F 1/02
US Classification:
148 24, 75255, 428570, 106 105
Abstract:
A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys.