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Ilya E Reyzin

from Sacramento, CA
Age ~79
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Also known as:
Ilya Ed Reyzin, Ily Ed Reyzin, Ed Reyzin Ilya, Llya E Reyzin, Reyzin Ilyq Ed, Ed Reyzin, Ilya Reyzim, Q Ed Reyzin, Ilya N
Phone and address:
3301 N Park Dr UNIT 4316, Sacramento, CA 95835
Related to:
Izrail ReyzinaDmitriy Voloshin, 48
Connected to:
Peter Rez, 72Aaron R Reza, 39Adrian M Reza, 74Agustin A Reza, 39Ahmad Reza, 35Alberto D Reza, 45Ali Reza, 61Benjamin Reza, 41Christian H Reza, 27Debbie F Reza, 43

Ilya Reyzin Phones & Addresses

  • 3301 N Park Dr UNIT 4316, Sacramento, CA 95835
  • 682 Allison Rd, Richmond Heights, OH 44143
  • 5605 Mayfield Rd, Cleveland, OH 44124
  • Richmond Hts, OH
  • 651 Ayer Rd, Buffalo, NY 14221

Resumes

Resumes

Ilya Reyzin Photo 1

Senior Project Engineer

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Location:
Oklahoma City, OK
Industry:
Mechanical Or Industrial Engineering
Work:
Creativedezign Jan 2009 - Sep 2009
Principal Scientist - Consulting
International Environmental Corporation Jan 2009 - Sep 2009
Senior Project Engineer
Delphi Thermal Gm Jan 1993 - Dec 2008
Senior .Product Engineer
Delphi Thermal Systems 1994 - 2008
Senior Project Engineer
Skills:
Industrial Engineering
Delphi
Thermal
Ilya Reyzin Photo 2

Senior .Project Engineer

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Location:
Sacramento, CA
Industry:
Consumer Goods
Work:
Rheem Manufacturing
Senior .Project Engineer
Ilya Reyzin Photo 3

Ilya Reyzin

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Publications

Us Patents

Thermosiphon For Electronics Cooling With High Performance Boiling And Condensing Surfaces

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US Patent:
6588498, Jul 8, 2003
Filed:
Jul 18, 2002
Appl. No.:
10/198321
Inventors:
Ilya Reyzin - Williamsville NY
Mohinder Singh Bhatti - Amherst NY
Debashis Ghosh - Amherst NY
Shrikant Mukund Joshi - Williamsville NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
F28D 1500
US Classification:
16510433, 16510421, 361700, 257716, 174 152
Abstract:
A thermosiphon for cooling an electronic device having a mean width of dimension âbâ comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.

Orientation Insensitive Thermosiphon Assembly For Cooling Electronic Components

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US Patent:
6695039, Feb 24, 2004
Filed:
Feb 25, 2003
Appl. No.:
10/374349
Inventors:
Ilya Reyzin - Williamsville NY
Mohinder Singh Bhatti - Amherst NY
Shrikant Mukund Joshi - Williamsville NY
Debashis Ghosh - Amherst NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
F28D 1500
US Classification:
16510421, 16510433, 361700, 257715, 174 152
Abstract:
A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.

Compact Thermosiphon With Enhanced Condenser For Electronics Cooling

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US Patent:
6714413, Mar 30, 2004
Filed:
Oct 15, 2002
Appl. No.:
10/271630
Inventors:
Debashis Ghosh - Amherst NY
Mohinder Singh Bhatti - Amherst NY
Ilya Reyzin - Williamsville NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 720
US Classification:
361700, 174 152, 257716, 16510433, 16510421, 361698, 361699
Abstract:
A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Leak Detection Apparatus For A Liquid Circulation Cooling System

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US Patent:
6826948, Dec 7, 2004
Filed:
Oct 9, 2003
Appl. No.:
10/684069
Inventors:
Mohinder Singh Bhatti - Amherst NY
Ilya Reyzin - Williamsville NY
Donald John Enzinna - Lockport NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01M 304
US Classification:
73 405R, 73 491, 73 495, 340605
Abstract:
A leak detection apparatus includes one or more detection devices that envelope the various pipe joints of a liquid circulation cooling system. In one approach, the detection devices include a pair of conductors separated by a wicking material impregnated with a crystalline salt that provides a low resistance electrical path between the conductors in the presence of a leak. In another approach, the detection devices include a pair of dissimilar metal mesh electrodes separated by an electrolyte-impregnated wicking material to form a water-activated battery that energizes an alarm in the presence of a leak. In either case, the electrodes and wicking material may be encased with a water-activated sealing material that hardens in the presence of a leak to contain the leakage.

Thermosiphon For Electronics Cooling With Nonuniform Airflow

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US Patent:
6834713, Dec 28, 2004
Filed:
Jul 18, 2002
Appl. No.:
10/198322
Inventors:
Debashis Ghosh - Amherst NY
Shrikant Mukund Joshi - Williamsville NY
Ilya Reyzin - Williamsville NY
Mohinder Singh Bhatti - Amherst NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
F28D 1500
US Classification:
16510433, 16510421, 174 152, 257715, 361700
Abstract:
A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Compact Thermosiphon For Dissipating Heat Generated By Electronic Components

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US Patent:
6840311, Jan 11, 2005
Filed:
Feb 25, 2003
Appl. No.:
10/374346
Inventors:
Debashis Ghosh - Amherst NY, US
Mohinder Singh Bhatti - Amherst NY, US
Ilya Reyzin - Williamsville NY, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 720
US Classification:
16510433, 361700
Abstract:
A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

Cooling Assembly

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US Patent:
6918431, Jul 19, 2005
Filed:
Aug 22, 2003
Appl. No.:
10/646505
Inventors:
Ilya Reyzin - Williamsville NY, US
Mohinder Singh Bhatti - Amherst NY, US
Debashis Ghosh - Amherst NY, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K007/20
US Classification:
16510421, 16510433, 361700
Abstract:
A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

Portable Air Filtration System

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US Patent:
6989051, Jan 24, 2006
Filed:
Aug 25, 2003
Appl. No.:
10/647748
Inventors:
Mark Joseph Parisi - East Amherst NY, US
Donald John Enzinna - Lockport NY, US
Susan Claire Vasko - Lockport NY, US
Ilya Reyzin - Williamsville NY, US
Stephan Michael Vetter - Lockport NY, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
B03C 3/155
US Classification:
96 67, 96 69, 96 97
Abstract:
A portable air filtration system includes a filter housing having an air inlet and an air outlet. The filter housing defines a filtration chamber between the air inlet and the air outlet. The portable air filtration system uses an ionizing mechanism, a filter media, and an electrode to filter air. The ionizing mechanism ionizes particles within the air to a negative charge. The filter media is disposed between the ionizing mechanism and the air outlet for entrapping the particles. The electrode is disposed between the ionizing mechanism and the filter media to establish an electric field. The electric field is established between the ionizing mechanism and the electrode adjacent to the filter media. The electrode is also electrically-connected to ground and to the filter media for dissipating the negative charge of the particles entrapped within the filter media.
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Ilya E Reyzin from Sacramento, CA, age ~79 Get Report