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Henry C Bosak

from Hillsboro, OR
Age ~65
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Also known as:
Henry Living Bosak, Hank Bosak, Henry Bosack
Phone and address:
662 Jamie Dr, Beaverton, OR 97124
(503) 693-9056
Related to:
Kathleen Margaret Kelly, 75
Connected to:
Brooke E Bosak, 39Christiane Bosak, 66Diane J Bosak, 72Edmund C Bosak, 97Henryk J Bosak, 76Jill L Bosak, 49Keith W Bosak, 51Kimberly D Bosak, 63Krista M Bosak, 45Venata Bosam, 72

Henry Bosak Phones & Addresses

  • 662 Jamie Dr, Hillsboro, OR 97124 (503) 693-9056
  • Beaverton, OR
  • Hamden, CT
  • Marlborough, MA
  • 662 NE Jamie Dr, Hillsboro, OR 97124 (503) 860-2582

Work

Company: Intel corporation 2005 to 2016 Position: Staff thermal mechanical engineer

Education

School / High School: The University of Akron Specialities: Engineering

Skills

Simulations • Engineering • Testing • Design of Experiments • Semiconductors • Electronics Packaging • Hardware Architecture • Asic • Thermal • Pcb Design • Soc • Electronics • Debugging • Embedded Systems • Failure Analysis • Engineering Management • Product Management • Mechanical Engineering • Pro Engineer • Intel • Cross Functional Team Leadership • Thermal Management • Product Development • Product Engineering • Program Management • Systems Engineering • Ptc Creo • Product Design

Industries

Computer Hardware

Resumes

Resumes

Henry Bosak Photo 1

Staff Product Engineer

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Location:
19750 northwest Phillips Rd, Hillsboro, OR 97124
Industry:
Computer Hardware
Work:
Intel Corporation 2005 - 2016
Staff Thermal Mechanical Engineer
Lam Research 2005 - 2016
Staff Product Engineer
Ltx-Credence 2002 - 2004
Principal Thermal Mechanical Engineer
Ibm 1999 - 2002
Senior Thermal Mechanical Engineer
Sequent 1990 - 1999
Senior Thermal-Mechanical Engineer
Education:
The University of Akron
Skills:
Simulations
Engineering
Testing
Design of Experiments
Semiconductors
Electronics Packaging
Hardware Architecture
Asic
Thermal
Pcb Design
Soc
Electronics
Debugging
Embedded Systems
Failure Analysis
Engineering Management
Product Management
Mechanical Engineering
Pro Engineer
Intel
Cross Functional Team Leadership
Thermal Management
Product Development
Product Engineering
Program Management
Systems Engineering
Ptc Creo
Product Design

Publications

Us Patents

Flexible Coupling For Heat Sink

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US Patent:
20030024698, Feb 6, 2003
Filed:
Aug 1, 2001
Appl. No.:
09/920700
Inventors:
Henry Bosak - Hillsboro OR, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F28F007/00
H05K007/20
US Classification:
165/185000, 361/708000, 165/080300
Abstract:
A flexible coupling for bonding a heat source to a heat dissipator. The coupling is comprised of a diaphragm and an interface. Both the diaphragm and the interface are comprised of thermally conductive materials. The interface bonds with the heat source, and the perimeter of the diaphragm is mounted to a wall of a vapor chamber. The resilient characteristic of the diaphragm enables bonding with a single heat source or multiple heat sources. In addition, the diaphragm provides a uniform bond-line surface between the heat source and the heat dissipator. Accordingly, the flexible coupling reduces thermal resistance associated with bonding coplanar and misaligned surfaces by mitigating non-uniform application of thermal interface materials.

Multi-Chip Self Adjusting Cooling Solution

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US Patent:
20190067158, Feb 28, 2019
Filed:
Oct 30, 2018
Appl. No.:
16/175712
Inventors:
- Santa Clara CA, US
Susan F. SMITH - Olympia WA, US
Mani PRAKASH - University Place WA, US
Tao LIU - Dupont WA, US
Henry C. BOSAK - Hillsboro OR, US
Harvey R. KOFSTAD - Vernonia OR, US
Almanzo T. ORTIZ - Chandler AZ, US
International Classification:
H01L 23/367
H01L 23/433
H01L 25/065
H01L 23/40
Abstract:
An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
Control profile
Henry C Bosak from Hillsboro, OR, age ~65 Get Report