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Hamlet Karine Abedmamoore

from San Diego, CA
Age ~67
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Also known as:
Hamlet K Abedmamoore, Hamlet Karine Abedmamoor, Hamlet Abednamoore, Hemlet Abedmamoore, Hamlet Abednamodre, Hamlet Abedmanoore, Abedmamoore Hamlet
Related to:
Andre A AvedianAmanda Abedmamoore, 27Lilia C Chilian, 55Andre A Abedmamoore, 30Gayane Keshishian, 55Karapet G Ambaryan, 57Karine Ambaryan, 59
Connected to:
Stephen I Abedon, 62Niddal M Abedrabbo, 36Bryan D Abee, 58Glenn A Abee, 62Ronald B Abee, 95Ryan D Abee, 47Susan E Abeel, 63Berhanu Abegaz, 70Meaza Abegaz, 39Meseret W Abegaz, 55

Hamlet Abedmamoore Phones & Addresses

  • San Diego, CA
  • Glendale, CA
  • Los Angeles, CA
  • 9686 Oviedo St, San Diego, CA 92129

Work

Company: Pulse electronics corporation Position: Engineering manager at pulse electronics corporation

Education

Degree: Associate degree or higher

Skills

Product Development • Electronics • Cross Functional Team Leadership • Manufacturing • Engineering • Semiconductors • Pcb Design • Product Management • Ic • Lean Manufacturing • Six Sigma • Testing • Program Management • Product Marketing • Analog • Engineering Management • Process Improvement • Business Process Improvement • Business Development • Management • Project Management

Emails

a***[email protected]

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Hamlet Abedmamoore Photo 1

Engineering Manager At Pulse Electronics Corporation

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Location:
2 Pearl Buck Ct, Bristol, PA 19007
Industry:
Electrical/Electronic Manufacturing
Work:
Pulse Electronics Corporation
Engineering Manager at Pulse Electronics Corporation
Skills:
Product Development
Electronics
Cross Functional Team Leadership
Manufacturing
Engineering
Semiconductors
Pcb Design
Product Management
Ic
Lean Manufacturing
Six Sigma
Testing
Program Management
Product Marketing
Analog
Engineering Management
Process Improvement
Business Process Improvement
Business Development
Management
Project Management

Publications

Us Patents

Simplified Surface-Mount Devices And Methods

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US Patent:
20060114094, Jun 1, 2006
Filed:
Sep 20, 2005
Appl. No.:
11/231486
Inventors:
Henry Jean - Chula Vista CA, US
Hamlet Abedmamoore - San Diego CA, US
Peter Gutierrez - San Diego CA, US
David Phan - San Diego CA, US
International Classification:
H01F 27/28
US Classification:
336182000
Abstract:
A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer, inductor, or mixer is required. In one exemplary embodiment, the device includes a “binocular” ferrite core comprising a plurality of core apertures and windings. The core is shaped with one or more channels which are at least partly plated (metallized) so as to allow bonding of the winding terminations directly to the core. The placement of these plated areas allows simplified surface mounting. The plated areas also obviate a termination header, thereby simplifying the manufacture of the device and reducing its cost. Methods for manufacturing the device are also disclosed.

Choke Coil Devices And Methods Of Making And Using The Same

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US Patent:
20140154920, Jun 5, 2014
Filed:
Mar 15, 2013
Appl. No.:
13/835217
Inventors:
Pulse Electronics, Inc. - , US
Mohammad Saboori - San Diego CA, US
Aurelio Gutierrez - Bonita CA, US
Hamlet Abedmamoore - San Diego CA, US
International Classification:
H01F 17/02
H01F 41/06
H01R 13/66
US Classification:
43962001, 336208, 29605
Abstract:
A chip choke assembly which reduces the loss of magnetic flux from the underlying core portions. In one embodiment, this reduction is achieved by producing a chip choke assembly comprised of two or more chip choke portions that collectively form a closed magnetic path. Additionally, the chip choke assembly disclosed herein also allows for adequate clearance between adjacent pads so as to avoid arcing during high potential voltage conditions. Methods for manufacturing and using the aforementioned chip choke assembly are also disclosed.

Substrate Inductive Device Methods And Apparatus

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US Patent:
20140125446, May 8, 2014
Filed:
Mar 12, 2013
Appl. No.:
13/797530
Inventors:
- San Diego CA, US
Mark Greene - San Diego CA, US
Vinay Gundotra - San Diego CA, US
Hamlet Abedmamoore - San Diego CA, US
International Classification:
H01F 27/28
H01F 41/04
US Classification:
336221, 336229, 296021
Abstract:
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Substrate Inductive Device Methods And Apparatus

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US Patent:
20140126162, May 8, 2014
Filed:
Mar 12, 2013
Appl. No.:
13/797501
Inventors:
- San Diego CA, US
Vinay Gundotra - San Diego CA, US
Hamlet Abedmamoore - San Diego CA, US
International Classification:
H05K 1/18
H05K 3/30
US Classification:
361748, 174260, 29607
Abstract:
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures by incorporating surface mountable chip chokes in the underlying circuit design, These conditions that result in undesirable CAF include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Methods And Apparatus For Extending Transformer Bandwidth With Mixed-Mode Coupling Using A Substrate Inductive Device

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US Patent:
20140127944, May 8, 2014
Filed:
Oct 18, 2013
Appl. No.:
14/057900
Inventors:
- San Diego CA, US
Mohammad Saboori - San Diego CA, US
Mark Greene - Sa Diego CA, US
Hamlet Abedmamoore - San Diego CA, US
International Classification:
H01F 17/00
H01F 41/00
H01R 13/66
US Classification:
43962025, 336200, 296021
Abstract:
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
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Hamlet Karine Abedmamoore from San Diego, CA, age ~67 Get Report