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Halbert S Tam

from Milpitas, CA
Age ~50

Halbert Tam Phones & Addresses

  • 1102 Courtland Ave, Milpitas, CA 95035 (408) 569-6611
  • 2234 Devon Pl, Milpitas, CA 95035
  • Austin, TX
  • 1577 Quebec Ct, Sunnyvale, CA 94087
  • 1358 41St Ave, San Francisco, CA 94122
  • 1978 Bellomy St, Santa Clara, CA 95050
  • San Jose, CA
  • 1102 Courtland Ave, Milpitas, CA 95035

Work

Company: Alta devices Nov 2018 Position: Director, manufacturing engineering

Education

Degree: Bachelors, Bachelor of Science School / High School: University of California, Berkeley Specialities: Chemical Engineering

Skills

Thin Films • Design of Experiments • Metrology • Semiconductors • Process Simulation • Failure Analysis • Spc • Engineering Management • Semiconductor Industry • R&D • Engineering • Manufacturing • Photovoltaics • Pvd • Process Engineering • Materials Science • Cvd • Process Integration • Product Engineering • Quality System • Characterization • Semiconductor Process • Systems Engineering • Optics • Manufacturing Engineering • Solar Energy • Jmp • Labview • Photolithography • Simulations • Sputtering • Silicon • Pecvd • Solar Cells • Nanotechnology • Etching • Research and Development

Interests

Children • Economic Empowerment • Education • Environment • Poverty Alleviation • Science and Technology • Arts and Culture • Health

Industries

Renewables & Environment

Resumes

Resumes

Halbert Tam Photo 1

Director, Manufacturing Engineering

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Location:
2234 Devon Pl, Milpitas, CA 95035
Industry:
Renewables & Environment
Work:
Alta Devices
Director, Manufacturing Engineering

Alta Devices
Senior Engineering Manager

Alta Devices Jan 2016 - Aug 2016
Yield Engineering Manager

Alta Devices Oct 2011 - Jan 2016
Metrology Manager, Staff Engineer

Solyndra Jan 2008 - Aug 2011
Senior Member of Technical Staff, Manager
Education:
University of California, Berkeley
Bachelors, Bachelor of Science, Chemical Engineering
Skills:
Thin Films
Design of Experiments
Metrology
Semiconductors
Process Simulation
Failure Analysis
Spc
Engineering Management
Semiconductor Industry
R&D
Engineering
Manufacturing
Photovoltaics
Pvd
Process Engineering
Materials Science
Cvd
Process Integration
Product Engineering
Quality System
Characterization
Semiconductor Process
Systems Engineering
Optics
Manufacturing Engineering
Solar Energy
Jmp
Labview
Photolithography
Simulations
Sputtering
Silicon
Pecvd
Solar Cells
Nanotechnology
Etching
Research and Development
Interests:
Children
Economic Empowerment
Education
Environment
Poverty Alleviation
Science and Technology
Arts and Culture
Health

Publications

Us Patents

Integrated Processing System For Optical Devices

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US Patent:
20030128959, Jul 10, 2003
Filed:
Jan 4, 2002
Appl. No.:
10/038093
Inventors:
Phillip Sommer - Newark CA, US
Alexander Brudny - Saratoga CA, US
David Proscia - San Ramon CA, US
David Harvey - Sunol CA, US
Halbert Tam - Sunnyvale CA, US
International Classification:
G02B006/00
US Classification:
385/147000
Abstract:
The invention provides a method and apparatus to process and assemble optical subsystems. In one aspect, the optical subsystems are placed on a carrier apparatus adapted to support a plurality of the optical subsystems in a desired process orientation and with a desired spacing to provide high process throughput. In one aspect of the invention, optical components are assembled and sequentially processed in various steps, such as component installation, optical fiber preparation, component attachment, fiber trim, optical fiber polishing, and optical component testing to produce a finished optical subsystem.

Sti Polish Enhancement Using Fixed Abrasives With Amino Acid Additives

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US Patent:
20030176151, Sep 18, 2003
Filed:
Feb 12, 2002
Appl. No.:
10/074345
Inventors:
Halbert Tam - Santa Clara CA, US
Gregory Menk - Pleasaton CA, US
Assignee:
Applied Materials, Inc.
International Classification:
B24B007/30
US Classification:
451/041000
Abstract:
Methods and compositions are provided for planarizing a substrate with selective removal rates and low dishing, wherein the substrate comprises multiple dielectric materials, such as silicon oxide and a thin underlayer of silicon nitride used as a stop layer. One aspect of the method includes using a fixed abrasive polishing pad and at least one amino acid as a polishing fluid additive capable of significantly enhancing the polishing process. Amino acid addition in combination with fixed abrasive polishing of shallow trench isolation structures offers high topography and oxide to nitride selectivity.
Halbert S Tam from Milpitas, CA, age ~50 Get Report