Search

Granthana K Rangaswamy

from San Jose, CA
Age ~44

Granthana Rangaswamy Phones & Addresses

  • San Jose, CA
  • Sunnyvale, CA
  • Acton, MA
  • 5 Conservation Ln, Westford, MA 01886
  • Atlanta, GA
  • Santa Clara, CA

Publications

Us Patents

Validating High Speed Link Performance Margin For Switch Fabric With Any-To-Any Connection Across A Midplane

View page
US Patent:
20110267073, Nov 3, 2011
Filed:
Apr 29, 2010
Appl. No.:
12/769749
Inventors:
David P. CHENGSON - Aptos CA, US
Granthana Rangaswamy - Sunnyvale CA, US
Assignee:
Juniper Networks, Inc. - Sunnyvale CA
International Classification:
G01R 27/28
US Classification:
324628
Abstract:
A system for testing link performance margin in a network device includes one or more daughter cards having a driver to transmit a signal and a receiver to receive the signal, and a midplane including a channel to transmit the signal from the driver to the receiver. The system includes multiple connector assemblies to connect the one or more daughter cards to the midplane, where each of the multiple connector assemblies includes a different known crosstalk margin value. A bit error rate tester is connected to a link between the driver and the receiver, and the multiple connector assemblies are interchangeably included in the link to approximate different signal-to-noise ratio margins for the tested link.

Remote Radio Unit With Reduced Volume And Increased Thermal Efficiency

View page
US Patent:
20230096962, Mar 30, 2023
Filed:
Feb 16, 2022
Appl. No.:
17/673261
Inventors:
- Menlo Park CA, US
Kodanda Ram Reddy Engala - Irving TX, US
Granthana Kattehalli Rangaswamy - San Jose CA, US
Imad Shehab - La Jolla CA, US
Srishti Saraswat - Santa Clara CA, US
Farbod Tabatabai - San Francisco CA, US
Joseph David Volz - Pacifica CA, US
International Classification:
H05K 7/20
H03F 3/24
H04B 1/40
Abstract:
The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.
Granthana K Rangaswamy from San Jose, CA, age ~44 Get Report