US Patent:
20230096962, Mar 30, 2023
Inventors:
- Menlo Park CA, US
Kodanda Ram Reddy Engala - Irving TX, US
Granthana Kattehalli Rangaswamy - San Jose CA, US
Imad Shehab - La Jolla CA, US
Srishti Saraswat - Santa Clara CA, US
Farbod Tabatabai - San Francisco CA, US
Joseph David Volz - Pacifica CA, US
International Classification:
H05K 7/20
H03F 3/24
H04B 1/40
Abstract:
The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.