Inventors:
Yunsang Kim - Monte Sereno CA, US
Jack Chen - Fremont CA, US
Grace Fang - Fremont CA, US
Andrew Bailey - Pleasanton CA, US
International Classification:
H01L 21/306
C23F 1/02
Abstract:
Methods and apparatus for remedying arc-related damage to the substrate during plasma bevel etching. A plasma shield is disposed above the substrate to prevent plasma, which is generated in between two annular grounded plates, from reaching the exposed metallization on the substrate. Additionally or alternatively, a carbon-free fluorinated process source gas may be employed and/or the RF bias power may be ramped up gradually during plasma generation to alleviate arc-related damage during bevel etching. Also additionally or alternatively, helium and/or hydrogen may be added to the process source gas to alleviate arc-related damage during bevel etching.
