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Goran S Matijasevic

from San Clemente, CA
Age ~66
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Also known as:
Goran N Matijasevic, Gordan Matijasevic
Phone and address:
420 La Esperanza, San Clemente, CA 92672
(949) 492-4018
Related to:
John C CortSusan R Cort, 67Frank A RhodesEugene S Rhodes, 76Susan E Rhodes, 70Gina A Rhodes, 66Scepan D MatijasevicNicholas A RhodesVladimir Matijasevic, 64Biserka J Matijasevic
Connected to:
Aaron W Matijasic, 41Alan Matijas, 52Martin A Matijasich, 75Nancy C Matijasich, 61Noelle M Matijas, 45Danijela Matijevic, 54Egon M Matijevic, 103Maria M Matijevic, 54Sanja Matijevic, 34Roman C Matijkiw, 30

Goran Matijasevic Phones & Addresses

  • 420 La Esperanza, San Clemente, CA 92672 (949) 492-4018 (949) 492-7583 (949) 719-2821
  • Newport Beach, CA
  • Carlsbad, CA
  • Irvine, CA
  • Santa Ana, CA
  • Capistrano Beach, CA
  • 420 S La Esperanza, San Clemente, CA 92672

Work

Position: Machine Operators, Assemblers, and Inspectors Occupations

Education

Degree: Associate degree or higher

Resumes

Resumes

Goran Matijasevic Photo 1

Senior Assistant Vice Chancellor, Alumni And Constituent Relations

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Location:
San Diego, CA
Industry:
Research
Work:
UC Irvine since Mar 2013
Senior Assistant Vice Chancellor, Alumni and Constituent Relations
UC Irvine since 2010
Executive Director, Chief Executive Roundtable
National Academies University Industry Demonstration Partnership since Jan 2013
President (2013)
UC Irvine, The Henry Samueli School of Engineering 2002 - 2010
Director of Research Development
QPlus Networks 2001 - 2001
Senior Engineer, Integrated Optoelectronics Group
Education:
Pepperdine University, The George L. Graziadio School of Business and Management 2003
University of California, Irvine 1991
Skills:
Start Ups
Program Management
Entrepreneurship
Strategic Planning
Leadership
Research
R&D
Strategy
Strategic Partnerships
Cross Functional Team Leadership
Business Strategy
Telecommunications
Integrated Marketing
Product Development
Business Development
Management
Semiconductors
Public Speaking
Executive Management
Management Consulting
Competitive Analysis
New Business Development
Analysis
Business Planning
Manufacturing
Team Building
Simulations
Teaching
Biotechnology
Fundraising
Mergers and Acquisitions
Engineering
Product Marketing
Team Leadership
Networking
Process Improvement
Social Media
Market Research
Sbir
Venture Capital
Cloud Computing
Sensors
Systems Engineering
Nonprofits
Languages:
French
Italian
Goran Matijasevic Photo 2

Goran Matijasevic

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Goran Matijasevic
CTO
ORMET CIRCUITS, INC
Mfg Electronic Components · Industrial Patterns · Electric Housewares and Fans · Commercial Physical Research
6555 Nancy Rdg Dr STE 200, San Diego, CA 92121
10080 Willow Crk Rd, San Diego, CA 92131
10070 Willow Crk Rd, San Diego, CA 92131
(858) 831-0010, (858) 431-8212

Publications

Us Patents

Process For Producing High Performance Thermoelectric Modules

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US Patent:
61276197, Oct 3, 2000
Filed:
Jun 8, 1998
Appl. No.:
9/093966
Inventors:
Xiaomei Xi - Carlsbad CA
Goran S. Matijasevic - San Clemente CA
Lutz Brandt - Carlsbad CA
Linh Ha - Carlsbad CA
Assignee:
Ormet Corporation - Carlsbad CA
International Classification:
H01L 3528
H01L 3534
US Classification:
136203
Abstract:
A method for cost-effectively producing thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples is disclosed. This method makes the fabrication of very small size thermoelectric elements and miniaturized, compact, powerful thermoelectric modules possible. Methods of the present invention can be also used to fabricate integrated thermoelectric modules in electrical or other devices. The invented method is based on an additive technology using thermoelectric pastes and a patternable insulator layer. Layers of conductive traces are first fabricated on the two insulating planes. A patternable insulator layer is formed and filled with P- and N-type thermoelectric pastes. The thermoelectric elements are formed during the curing or sintering of the thermoelectric pastes. Sizes and positions of the thermoelectric elements are defined by the patterned insulator layer.

Vertically Interconnected Electronic Assemblies And Compositions Useful Therefor

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US Patent:
59485337, Sep 7, 1999
Filed:
Mar 6, 1997
Appl. No.:
8/813809
Inventors:
Catherine A. Gallagher - San Marcos CA
Goran S. Matijasevic - San Clemente CA
Pradeep Gandhi - Del Mar CA
M. Albert Capote - Carlsbad CA
Assignee:
Ormet Corporation - Carlsbad CA
International Classification:
H01B 102
H01B 122
US Classification:
428418
Abstract:
In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

Transient Liquid Phase Sintering Conductive Adhesives

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US Patent:
58536221, Dec 29, 1998
Filed:
Aug 28, 1996
Appl. No.:
8/704467
Inventors:
Catherine Gallagher - San Marcos CA
Goran Matijasevic - San Clemente CA
M. Albert Capote - Carlsbad CA
Assignee:
Ormet Corporation - Carlsbad CA
International Classification:
H01B 122
C21B 302
US Classification:
252512
Abstract:
An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) and a permanent adhesive flux binder provides the advantages of both conventional soldering technology and conductive adhesives. This hybrid approach delivers electrical and thermal conduction through sintered metal joints and mechanical properties based on a tailorable polymer matrix. These transient liquid phase sintering conductive adhesives can utilize conventional dispensing, placement, and processing equipment. During the reflow process, metal powders in the composition undergo interparticle sintering as well as alloying to the contact pads. This process produces a strong mechanical, thermal, and electrical interconnect which ensures good conductivity that is also resistant to humidity and temperature cycling.

Individual Embedded Capacitors For Laminated Printed Circuit Boards

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US Patent:
60687827, May 30, 2000
Filed:
Feb 11, 1998
Appl. No.:
9/021967
Inventors:
Lutz W. Brandt - Carlsbad CA
Goran Matijasevic - San Clemente CA
Pradeep R. Gandhi - Del Mar CA
Assignee:
Ormet Corporation - Carlsbad CA
International Classification:
H01B 1300
US Classification:
216 17
Abstract:
A method of fabricating individual, embedded capacitors in multilayer printed circuit boards is disclosed. The method is compatible with standard printed circuit board fabrication. The capacitor fabrication is based on a sequential build-up technology employing a first patternable insulator. After patterning of the insulator, pattern grooves are filled with a high dielectric constant material, typically a polymer/ceramic composite. Capacitance values are defined by the pattern size, thickness and dielectric constant of the composite. Capacitor electrodes and other electrical circuitry can be created either by etching laminated copper, by metal evaporation or by depositing conductive ink.

Isbn (Books And Publications)

Frontiers in Biomedical Devices Conference--2006: Proceedings of the Frontiers in Biomedical Devices Conference Presented at the Frontiers in Biomedical Devices Conference June 8-9, 2006, Irvine, Ca

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Author

Goran Matijasevic

ISBN #

0791847632

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Goran S Matijasevic from San Clemente, CA, age ~66 Get Report