Inventors:
Gilbert Zweig - Morris Plains NJ
David Zweig - Randolph NJ
Assignee:
Glenbrook Technologies Inc. - Randolph NJ
International Classification:
G01B 1506
Abstract:
This invention relates to a system for the removal and reattachment of a ball grid array (BGA) package component to a printed circuit board, that is adapted for the real time X-ray inspection of BGA package removal and reattachment. The system comprises heating means comprising upper and lower heating platens juxtaposed to each other for the reception, support and application of heat to the workpiece comprising the BGA package and the printed circuit board, wherein the heating means is prepared from materials that are transmissive to X-ray radiation. Suitable x-ray transmissive materials are selected from high melting point polymers, aluminum, glasses and ceramics, and include materials having an atomic number less than 14. The system includes X-ray inspection means comprising means for generating an X-ray beam for producing an X-ray image of the workpiece, fluoroscopic imaging means for generating a visible X-ray image of the workpiece; and video camera means for viewing the X-ray image and generating a video output of the X-ray image. The system extends to the simultaneous detection and inspection of the workpiece by conventional video means within the visible spectrum.