Inventors:
Edwin F. Johnson - Sunnyvale CA
Gerd R. Ley - San Jose CA
Douglas G. Lockie - Los Gatos CA
Clifford A. Mohwinkel - San Jose CA
Assignee:
Endwave Corporation - Sunnyvale CA
International Classification:
B23P 1900
US Classification:
29740, 29759, 29721, 29834
Abstract:
An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.