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George G Pinneo

from Overgaard, AZ
Age ~87
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Also known as:
George Guy Pinneo, George K Pinneo, Geo G Pinneo
Related to:
Jessalyn Pinneo, 39Eric M Lindh, 59Donald Teunon, 84Margarite K TeunonJanet PinneoGuy Pinneo, 57
Connected to:
Anne C Pinneo, 50Erin K Pinneo, 39James A Pinneo, 70John M Pinneo, 45Rosemary L Pinneo, 67Barbra A Pinner, 39Bryan E Pinner, 67Cayla A Pinner, 63Danica N Pinner, 33

George Pinneo Phones & Addresses

  • Overgaard, AZ
  • 1416 18Th St, Manhattan Beach, CA 90266 (310) 545-5951
  • 390 Quaker Hollow Ln, Round Lake, IL 60073 (224) 643-7200
  • Round Lake Beach, IL
  • Pinetop, AZ
  • Salt Lake City, UT
  • Heber, AZ
  • 1416 18Th St, Manhattan Bch, CA 90266 (310) 991-6228

Work

Company: Semiconductor ass'y & packaging Aug 1986 Position: Senior consultant

Education

School / High School: Case Institute of Technology 1955 to 1959 Specialities: Chemical Engineering

Skills

Waveguides • Ceramic Metal Feedthroughs • Fluxless Hard Solder • Project Management • Management • Program Management • Leadership • Microsoft Office • Strategic Planning • Engineering • Project Planning • Hermetic Feedthroughs and Waveguide Wind...

Languages

English

Emails

p***[email protected]

Industries

Aviation & Aerospace

Resumes

Resumes

George Pinneo Photo 1

Senior Consultant

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Location:
P/O Box 1269, Overgaard, AZ
Industry:
Aviation & Aerospace
Work:
Semiconductor Ass'y & Packaging
Senior Consultant
Education:
Case Institute of Technology 1955 - 1959
Case Institute of Technology (Now Case Western Reserve) 1955 - 1959
Skills:
Waveguides
Ceramic Metal Feedthroughs
Fluxless Hard Solder
Project Management
Management
Program Management
Leadership
Microsoft Office
Strategic Planning
Engineering
Project Planning
Hermetic Feedthroughs and Waveguide Windows
Languages:
English

Publications

Us Patents

Low Cost High Integrity Diode Laser Array

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US Patent:
6700913, Mar 2, 2004
Filed:
May 29, 2001
Appl. No.:
09/867042
Inventors:
George G. Pinneo - Manhattan Beach CA
Marijan D. Grgas - Rancho Palos Verdes CA
Kriss A. Bennett - Long Beach CA
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
H01S 500
US Classification:
372 43, 372 50, 372 66, 372 75, 372 88, 372 36
Abstract:
A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array.

Millimeter Wave Ceramic-Metal Feedthroughs

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US Patent:
59949759, Nov 30, 1999
Filed:
Apr 28, 1998
Appl. No.:
9/067217
Inventors:
Barry R. Allen - Redondo Beach CA
Randall J. DuPrey - Redondo Beach CA
George G. Pinneo - Manhattan Beach CA
Daniel T. Moriarty - El Segundo CA
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
H03H 500
US Classification:
333 26
Abstract:
A durable, broad-band low insertion loss RF feedthrough is formed of a straight conductor (5) centrally supported by, hermetically sealed to and axially extending through the center of a strong, rigid, impervious ceramic disk (3). The ceramic disk is hermetically sealed, directly or indirectly, to the metal barrier (11) through which the feedthrough is to propagate RF energy. The new ferrule and ferrule-less ceramic metal RF feedthroughs avoid the use of glass, conventional in existing feedthroughs. The novel feedthrough serves as the principal element of a microwave microstrip line to waveguide transition.

Hermetically Sealed Aluminum Package For Hybrid Microcircuits

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US Patent:
52236722, Jun 29, 1993
Filed:
Jun 11, 1990
Appl. No.:
7/535628
Inventors:
George G. Pinneo - Manhattan Beach CA
Marijan D. Grgas - San Pedro CA
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
H01L 2302
H01B 1726
US Classification:
174 524
Abstract:
A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.

Grid Formed With Silicon Substrate

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US Patent:
6018566, Jan 25, 2000
Filed:
Oct 24, 1997
Appl. No.:
8/957541
Inventors:
Carol D. Eberhard - Rolling Hills Estates CA
George G. Pinneo - Manhattan Beach CA
Moshe Sergant - Culver City CA
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
G21K 100
US Classification:
378154
Abstract:
An X-ray collimator grid is formed within a wafer of monocrystalline silicon material by forming a plurality of spaced parallel elongate slots within a planar surface of a silicon crystal wafer, and forming slats of heavy metal in situs within each of said slots, including squeegeeing the heavy metal into the slots, from particles of heavy metal, each said slat gripping the walls of an associated slot.
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George G Pinneo from Overgaard, AZ, age ~87 Get Report