Inventors:
Ge Wang - Huntington Beach CA
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
B32B 3500
Abstract:
A method is provided for attaching electronic components (12) onto a substrate (10) which allows quick, easy and inexpensive subsequent removal and re-attaching of the electronic component (12) to obtain an undamaged printed wiring board package. The method for attaching the electronic component (12) onto the substrate (10) includes bonding a component interlayer (18) onto the electronic component (12) with a component bonding layer (16), and forming an adhesive bond (14) between the component interlayer (18) and the substrate (10). If the removal of the electronic component (12) is needed, the electronic component (12) is removed from the substrate (10) by heating the component interlayer (18), thus melting the component bonding layer (16). If the re-attachment of the electronic component (12) is needed, the method for attaching the electronic component (12) onto the substrate (10) is repeated, using a new component interlayer (18). If necessary, the substrate (10) is bonded onto a substrate interlayer (19) with a substrate bonding layer (21), and the adhesive bond (14) is formed between the component interlayer (18) and the substrate interlayer (19).