Inventors:
Chris R. Snider - Noblesville IN, US
Vineet Gupta - Noblesville IN, US
Joseph K. Huntzinger - Kokomo IN, US
Michael G. Coady - Kokomo IN, US
Curtis Allen Stapert - Carmel IN, US
Kevin Earl Meyer - Swartz Creek MI, US
Timothy D. Garner - Kokomo IN, US
Jeffrey T. Bell - Kokomo IN, US
Robert L. Vadas - Noblesville IN, US
Donald G. Moeschberger - Kokomo IN, US
Allen E. Oberlin - Windfall IN, US
Paul C. Burton - S.E. Kentwood MI, US
Dan D. Carman - Russiaville IN, US
Gary L. Stahl - Kokomo IN, US
John Michael Matly - Kokomo IN, US
Rick L. Hatcher - Cicero IN, US
Edgar Glenn Hassler - Sharpsville IN, US
Quan N. Nguyen - Fort Wayne IN, US
William R. Reed - Cicero IN, US
Kip R. Piel - Kokomo IN, US
Jerry J. Wendling - Anderson IN, US
Tim A. Kenworthy - Greentown IN, US
Paul A. Uglum - Noblesville IN, US
Michael E. Fye - Kokomo IN, US
Philip M. Scott - Kokomo IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 5/00
US Classification:
361752, 361685, 361704, 361724, 29830
Abstract:
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection.