US Patent:
20200230911, Jul 23, 2020
Inventors:
- St. Paul MN, US
Garth V. Antila - Hudson WI, US
Brent R. Hansen - New Richmond WI, US
Thomas P. Hanschen - Mendota Heights MN, US
Jay M. Jennen - Forest Lake MN, US
Jeffrey P. Kalish - St. Paul MN, US
Duy K. Lehuu - Lake Elmo MN, US
Jason D. McNulty - Stillwater MN, US
Caitlin E. Meree - St. Paul MN, US
Joseph D. Rule - Woodbury MN, US
International Classification:
B32B 5/18
B24B 37/24
Abstract:
Polymeric foam layer having a thickness up to 25,700 micrometers, having first and second opposed major surfaces, and comprising foam features extending from or into the first major surface by at least 100 micrometers, and having a Tin a range from −125 C. to 150 C., wherein the first and second opposed major surfaces are free of exposed internal porous cells (i.e., less than 10 percent of the surface area of each of the first and second major surface has any exposed porous cells) and wherein at least 40 percent by area of each major surface has an as-cured surface; and methods of making the same. Exemplary uses of polymeric foam layers described herein including a finishing pad for silicon wafers and vibration damping.