Inventors:
Pil Je Sung - Dongjak-gu, KR
Garry Pycroft - San Jose CA, US
Assignee:
Amkor Technology, Inc. - Chandler AZ
International Classification:
H01L 23/495
US Classification:
257676, 257666, 257678, 136252, 136230
Abstract:
In accordance with the present invention, there is provided a CPV package which comprises a leadframe assembly, such leadframe assembly including multiple frames stacked on top of each other. A top frame of the leadframe assembly provides the electrical interconnect between the top or front surface of the receiver die and the bypass diode required to complete the circuit. The top frame also provides hook up wire interconnect pads for the completed CPV package. An exposed bottom surface of a bottom frame of the leadframe assembly defines a heat spreader which assists in thermal management. The fabrication of the CPV package to include multiple frames stacked on top of each other provides high thermal dissipation and high voltage isolation, while at the same providing a high level of reliability with a comparatively low manufacturing cost.