Garland D Cotney

D2846110, Jul 8, 1986

Aug 1, 1983

6/519336

Garland D. Cotney - Tempe AZ
Scot W. Taylor - Tempe AZ

Motorola, Inc. - Schaumburg IL

D34 40

55902324, Dec 31, 1996

Feb 16, 1995

8/390209

Robert M. Wentworth - Phoenix AZ
David Galloway - Tempe AZ
Garland D. Cotney - Tempe AZ
Brian A. Webb - Chandler AZ

Motorola, Inc. - Schaumburg IL

G02B 600
G02B 636

385 92

An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.

50350340, Jul 30, 1991

Jul 16, 1990

7/553015

Garland D. Cotney - Tempe AZ

Motorola, Inc. - Schaumburg IL

H01L 2160
H01L 2168

29 2501

A multi-fingered clamp assembly provides for the independent clamping of individual leads of a semiconductor device lead frame during wire bonding. The assembly consists of a clamp frame which carries and supports an interchangeable clamp insert. The clamp insert provides individual spring-like fingers which align directly with the leads to be clamped, clamping each lead independently and uniformly. This results in better, more uniform mechanical integrity of the bond. The clamp frame is aligned to the wire bond equipment, allowing a new clamp insert to be inserted for a different application without necessitating realignment.