Fusao S Ishii

6565222, May 20, 2003

Nov 17, 2000

09/716081

Fusao Ishii - Pittsburgh PA
Joseph A. Marcanio - Greensburg PA

Sony Corporation - Tokyo
Sony Electronics, Inc. - Park Ridge NJ

G02B 502

359883, 359884, 359871, 359872, 359584

A video projection device includes a cabinet having front and rear sections and a projection tube for projecting a video image. The video projection device also includes a screen located in the front section of the cabinet. The screen has a first surface onto which the video image is projected and a second surface for displaying the video image so that it is observable by a viewer. A mirror is arranged in the cabinet for reflecting light to the first surface of the screen. The mirror is a composite laminate mirror that includes a rigid substrate and a reflective sheet laminated to the rigid substrate. The rigid substrate may be a glass substrate and the reflective sheet may be a flexible plastic sheet. The reflective sheet may have a multilayer construction that includes a metallic film. The reflective sheet may alternatively include a second substrate and at least one thin film layer deposited on the substrate.

6554438, Apr 29, 2003

Jun 27, 2001

09/892955

Fusao Ishii - Pittsburgh PA
Joseph A. Marcanio - Greensburg PA

Sony Corporation - Tokyo
Sony Electronics, Inc. - Park Ridge NJ

G02B 7182

359883, 359884, 359847, 359846

A video projection device includes a cabinet having front and rear sections and a projection tube for projecting a video image. The video projection device also includes a screen located in the front section of the cabinet. The screen has a first surface onto which the video image is projected and a second surface for displaying the video image so that it is observable by a viewer. A mirror is arranged in the cabinet for reflecting light to the first surface of the screen. The mirror is a composite laminate mirror that includes a rigid substrate and a reflective sheet laminated to the rigid substrate. The rigid substrate may be a glass substrate and the reflective sheet may be a flexible plastic sheet. The reflective sheet may have a multilayer construction that includes a metallic film. The reflective sheet may alternatively include a second substrate and at least one thin film layer deposited on the substrate.

6862127, Mar 1, 2005

Nov 1, 2003

10/699140

Fusao Ishii - Menlo Park CA, US

G02B026/00
G02B026/08
H01L021/50

359291, 359290, 359223, 438114, 438115

A 1 dimensional or 2 dimensional array of micromirror devices comprises a device substrate with a 1st surface and a 2nd surface, control circuitry disposed on said 1st surface and a plurality of micromirrors disposed on said 2nd surface. Each micromirror comprises a reflective surface that is substantially optically flat, with neither recesses nor protrusions. Such a 1 dimensional or 2 dimensional array of micromirror devices may be used as a spatial light modulator (SLM). Methods of fabricating arrays of micromirror devices are also disclosed. Such methods generally involve providing a device substrate with a 1st surface and a 2nd surface, fabricating control circuitry on the 1st surface, and fabricating micromirrors on the 2nd surface, such that the reflective surfaces of the micromirrors are substantially optically flat, with neither recesses nor protrusions.

6903860, Jun 7, 2005

Nov 1, 2003

10/699143

Fusao Ishii - Menlo Park CA, US

G02B026/00

359290, 359230

A vacuum packaged electromechanical micromirror array comprises a 1st packaging substrate, a 2nd packaging substrate, a device substrate with a 1st surface and a 2nd surface, control circuitry on said 1st surface, and micromirrors on said 2nd surface. The device substrate resides on the 1st packaging substrate with electrical connections between them. The electromechanical micromirror array is sealed in a vacuum package formed by the packaging substrates. The vacuum packaged micromirror array may be used as a spatial light modulator (SLM). Methods of fabricating the vacuum packaged array are disclosed. Such methods generally involve providing a device substrate with a 1st surface and a 2nd surface, fabricating control circuitry on the 1st surface, fabricating micromirrors on the 2nd surface, providing a 1st packaging substrate, mounting the device substrate on the 1st packaging substrate by flip-chip assembly, providing a 2nd packaging substrate, and sealing the packaging substrates by glass frit sealing.

7183618, Feb 27, 2007

Aug 14, 2004

10/918677

Fusao Ishii - Menlo Park CA, US

G02B 26/08

257415, 257432, 257E31127, 438 31, 359224, 359318

An improved hinge for a micro-mirror device composed of a conductive doped semiconductor and immune to plastic deformation at typical to extreme temperatures. The hinge is directly connected to the micro-mirror device and facilitates the manufacturing of an optically flat micro-mirror. This eliminates Fraunhofer diffraction due to recesses on the reflective surface of the micro-mirror. In addition, the hinge is hidden from incoming light thus improving contrast and fill-factor.

7215460, May 8, 2007

Jul 16, 2005

11/183216

Fusao Ishii - Menlo Park CA, US

G02B 26/00

359291, 359290

A micromirror device with a lower driving voltage is disclosed. The lower driving voltage is achieved by projecting a partial light for image display during a micromirror is oscillating from fully on state to a fully off state. The micromirror device includes a reflective element supported on a hinge for oscillating and positioning at least three states. These three states are a fully on state, a fully off state, and a partially ON angular positions in responding to a digital control signal. The oscillation of the micromirrors is controlled in responding to a digital control signal wherein the digital control signal is controlled for writing into display pixels in an interleave-and-jump sequence to jump multiple lines to non-sequential lines of a display image.

7304783, Dec 4, 2007

May 23, 2005

11/136041

Fusao Ishii - Menlo Park CA, US

G02B 26/00

359290, 359291, 359292

A micromirror device with at least one intermediate state is disclosed in this invention with the reflecting mirror placed at an angular position between a fully on angle and fully off angle. The micromirror device includes a reflecting element supported on a hinge for oscillating and positioning at least three angular positions. The micromirror device further has a control circuit for receiving a series of control words of different number of bits as a time modulation signal to control the reflecting element for controlling a gray scale of display wherein the control circuit further receiving an oscillation signal for superimposing on the time modulation signal for oscillating the reflecting element for further controlling the gray scale of display. The series of control words further includes a sequence of control words of a least number of bits to a maximum number of bits of a least number of bits to a maximum number of bits with a time gap between each of the control words. The oscillating signal may be inserted optionally into a gap between the control words, into every control word, into a control word of the MSB, or into a control word of the LSB, In a preferred embodiment, the oscillating signal is applied to dispose the reflecting element at an intermediate state with a zero degree relative to an incident light.

7375872, May 20, 2008

Jul 23, 2005

11/187248

Fusao Ishii - Menlo Park CA, US

Silicon Quest Kabushiki-Kaisha - Kanagawa

G02B 26/00
G02B 26/08
G02F 1/29

359290, 359291, 359295, 359298

An image display system includes an improved hinge for a micro-mirror device composed of a conductive doped semiconductor and immune to plastic deformation at typical to extreme temperatures. The hinge is directly connected to the micro-mirror device and facilitates the manufacturing of an optically flat micro-mirror. This eliminates Fraunhofer diffraction due to recesses on the reflective surface of the micro-mirror. In addition, the hinge is hidden from incoming light thus improving contrast and fill-factor. The image display system further includes signal transmission metal traces formed on areas between the doped semiconductor hinges. The signal transmission metal traces are formed either before or after a high temperature crystallization process is applied to the hinges.