Inventors:
Fred L. Supnet - San Jose CA
International Classification:
C25D 502
C25D 554
Abstract:
A method of fabricating mask-over-copper printed circuit boards from a laminated insulated board material having conductive metallic coatings on both sides thereof includes piercing a plurality of holes completely through the laminate, forming a desired circuit connection pattern of copper extending between selected holes on the laminate first side and electrically connecting the laminate first side connection pattern to the second side copper coating by depositing copper material through the holes. A solder mask is applied to the areas of the first side connection pattern which are to be protected from solder during subsequent fabrication steps and then a protective metallic material is electroplated to portions of the first side connection pattern not covered by the solder mask and to desired portions of a circuit connection pattern on the second side conductive metallic coating, and the portions of the laminate second side conductive metallic coating outside the second side connection pattern are then removed.