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Forest I Hampton

from Amherst, OH
Age ~54
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Also known as:
Forest J Hampton, Forrest J Hampton
Related to:
Donna M Herron, 71Paula K HamptonMonica A Hampton, 54Stephanie HamptonZenia M Leonard, 73Gabriella Hampton, 43Marilyn D Burkhart, 83Rachelle D Burkhart, 55Hampton Forest, 79John A Burkhart, 56Rodney L Hampton, 50Richard A Leonard, 77John A Burkhart, 33
Connected to:
Adria C Hampton, 36Alan L Hampton, 45Albert Hampton, 46Alexa S Hampton, 54Ambrose D Hampton, 30Andre Hampton, 50Angie Hampton, 58Anna M Hampton, 47Arreanna A Hampton, 34Asia Hampton, 39

Forest Hampton Phones & Addresses

  • Amherst, OH
  • 449 Kenyon Ave, Elyria, OH 44035 (440) 323-6866
  • Hoffman Estates, IL
  • Toledo, OH
  • 9727 Pleasant Lake Blvd, Cleveland, OH 44130
  • Parma, OH
  • Lorain, OH
  • 695 Winesap Rd, Amherst, OH 44001 (440) 984-7128

Work

Position: Craftsman/Blue Collar

Education

Degree: High school graduate or higher

Publications

Us Patents

Adhesive Compositions And Methods Of Using The Same

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US Patent:
20060030689, Feb 9, 2006
Filed:
Apr 12, 2005
Appl. No.:
11/104032
Inventors:
Amrit Parhar - North Ridgeville OH, US
Forest Hampton - Elyria OH, US
Charles Bush - Bay Village OH, US
Fred Scholer - East Windsor NJ, US
International Classification:
C08G 64/00
C08G 69/10
US Classification:
528196000, 528328000
Abstract:
Adhesive compositions are described which comprise at least one organic sulfoxide, sulfone or sulfide and at least one ketone, ether, ester, amide or carbonate or a mixture thereof. The adhesive compositions also may contain one or more water insoluble polymers such as ABS, PVC and CPVC. Methods of adhesively bonding or welding a first plastic surface to a second plastic surface using these adhesive compositions also are described.

Universal Solvent Cement

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US Patent:
20060252865, Nov 9, 2006
Filed:
May 6, 2005
Appl. No.:
11/123262
Inventors:
Charles Bush - Bay Village OH, US
Forest Hampton - Elyria OH, US
Amrit Parhar - North Ridgeville OH, US
International Classification:
C08K 5/07
US Classification:
524356000, 524556000
Abstract:
A solvent cement for bonding PVC, CPVC and ABS plastic pipe and other molded articles comprises a minor amount of an acrylic resin and one or more solvents capable of dissolving the acrylic resin and further capable of dissolving at least the surfaces of PVC, CPVC and ABS molded articles, wherein the acrylic resin constitutes at least 75 wt. % of the dissolved thermoplastic resin in the cement.

Multi-Layer Structure And Method For Forming A Thermal Interface With Low Contact Resistance Between A Microelectronic Component Package And Heat Sink

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US Patent:
20020148635, Oct 17, 2002
Filed:
Mar 1, 2002
Appl. No.:
10/090540
Inventors:
Richard Hill - Parkman OH, US
Forest Hampton - Elyria OH, US
Assignee:
THERMAGON INC.
International Classification:
H05K001/00
US Classification:
174/252000
Abstract:
A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03 C.-in/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
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Forest I Hampton from Amherst, OH, age ~54 Get Report