Yu Fen Chen

6406861, Jun 18, 2002

Oct 6, 1999

09/413044

Daniel R. Henderson - Palo Alto CA
Yu Chen - Sunnyvale CA
De Chao Yu - Foster City CA

Cell Genesys, Inc. - Foster City CA

G01N 3353

435 71, 4241401, 4242331, 4241311, 4241591, 4242781, 424 931, 530351, 514885

Methods of reducing pre-existing humoral immunity to a viral immunogenic therapeutic agent such as adenovirus, using immunoapheresis are disclosed. Antibodies specific for the viral immunogenic therapeutic agent are selectively removed from the blood of an individual prior to administration of the viral immunogenic therapeutic agent by reaction extracorporeally with an immunosorbent which specifically binds the antibody. After the antibody is selectively removed from the blood, the blood is reinfused into the patient and the viral immunogenic therapeutic agent is administered. The invention also provides kits and compositions for selective removal of anti-viral antibody.

6548893, Apr 15, 2003

Jul 3, 2001

09/898567

Yu Ju Chen - San Ramon CA
Hui Wu - Milpitas CA

BigBear Networks, Inc. - Milpitas CA

H01L 2312

257704, 257693, 257710, 257728

An apparatus and method for hermetically sealing, EMI shielding integrated circuits for high-speed electronic devices using a combination of microstrip to buried stripline interface for signal transmission from the integrated circuit. The packaging provided comprises a first plurality of microstrips interconnecting the integrated circuit to a plurality of buried striplines exposed on a surface of the main substrate. A ceramic interposer placed over the main substrate âburiesâ a portion of the exposed striplines on the main substrate to thereby insulate these signal paths from a hermetically sealing, and EMI shielding metal lid placed over the integrated circuit. The metal lid and the seal ring brazed over the ceramic interposer thus provide both a hermetic seal and an electric radiation block. A reduction in dispersion due to the buried striplines is also achieved, as well as improving jitter performance.

6697260, Feb 24, 2004

Oct 29, 2001

10/040421

Yu Ju Chen - San Ramon CA
Thomas J. Sleboda - Milpitas CA
Michael Zhong Xuan Wong - Milpitas CA
Hui Wu - Milpitas CA

Big Bear Networks, Inc. - Milpitas CA

H05K 500

361752, 361753, 361736, 361735, 361785, 361803, 361796

An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is âfloatedâ up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

6884327, Apr 26, 2005

Mar 16, 2002

10/101492

Tao Pan - San Jose CA, US
Richard E. Demaray - Portola Valley CA, US
Yu Chen - San Jose CA, US
Yong Jin Xie - Cupertino CA, US
Rajiv Pethe - San Jose CA, US

C23C014/34

20419212, 4272481, 427259, 427282

A process for forming a mode size converter with an out-of-plane taper formed during deposition with a shadow mask is disclosed. Mode-size converters according to the present invention can have any number of configurations. Measured coupling efficiencies for waveguides with mode size converters according to the present invention show marked improvement.

6911200, Jun 28, 2005

Mar 21, 2001

09/814357

Yu Chen - Cupertino CA, US
Daniel R. Henderson - Palo Alto CA, US

Cell Genesys, Inc. - Foster City CA

A01N063/00
A61K048/00
C12N015/861

424 932, 435455, 435456, 4353201

The invention provides methods of treating neoplasia using combinations of target cell-specific replication competent adenoviral vectors and chemotherapy, radiation therapy or combinations thereof. The adenoviral vectors are target cell-specific for the particular type of neoplasia for which treatment is necessary and the combination with the chemotherapy and/or radiation leads to synergistic treatment over existing adenoviral therapy or traditional chemotherapy and radiation therapy.

7276233, Oct 2, 2007

Jun 27, 2005

11/166234

Yu Chen - Cupertino CA, US
Daniel R. Henderson - Palo Alto CA, US

Cell Genesys, Inc. - South San Francisco CA

A01N 63/00
A61K 48/00

424 932

The invention provides methods of treating neoplasia using combinations of target cell-specific replication competent adenoviral vectors and chemotherapy, radiation therapy or combinations thereof. The adenoviral vectors are target cell-specific for the particular type of neoplasia for which treatment is necessary and the combination with the chemotherapy and/or radiation leads to synergistic treatment over existing adenoviral therapy or traditional chemotherapy and radiation therapy.

7673143, Mar 2, 2010

Feb 24, 2004

10/786345

William J. Yeager - Menlo Park CA, US
Yu Chen - San Jose CA, US
Brian K. Raymor - Arlington VA, US
Jackson Wong - Menlo Park CA, US

Sun Microsystems, Inc. - Menlo Park CA

H04L 9/32

713175, 713153, 713168

A method for securing a communication between a peer node and an intermediary peer node in a peer-to-peer network comprises the peer node generating a secured communication request to the intermediary peer node. The intermediary peer node authenticates the peer node in response to the secured communication request. The intermediary peer node issues a signed certificate of authority upon successful authentication.

7977240, Jul 12, 2011

Feb 13, 2009

12/371239

Joerg Rockenberger - San Jose CA, US
Yu Chen - Pearland TX, US
Fabio Zürcher - Brisbane CA, US
Scott Haubrich - Albuquerque NM, US

Kovio, Inc. - Milpitas CA

H01L 21/44
H01L 21/4763

438674, 438622, 438637, 257E21273

Metal ink compositions, methods of forming such compositions, and methods of forming conductive layers are disclosed. The ink composition includes a bulk metal, a transition metal source, and an organic solvent. The transition metal source may be a transition metal capable of forming a silicide, in an amount providing from 0. 01 to 50 at. % of the transition metal relative to the bulk metal. Conductive structures may be made using such ink compositions by forming a silicon-containing layer on a substrate, printing a metal ink composition on the silicon-containing layer, and curing the composition. The metal inks of the present invention have high conductivity and form low resistivity contacts with silicon, and reduce the number of inks and printing steps needed to fabricate integrated circuits.