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Ethan Huwe Phones & Addresses

  • Woodinville, WA
  • 702 Birch Dr, Campbell, CA 95008
  • Sunnyvale, CA
  • Davis, CA
  • Santa Clara, CA
  • Sacramento, CA
  • Redondo Beach, CA
  • Cedar Falls, IA
  • Perham, MN
  • Cambridge, MA

Publications

Us Patents

Self Adapting Alert Device

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US Patent:
20110077055, Mar 31, 2011
Filed:
Sep 30, 2009
Appl. No.:
12/571326
Inventors:
Dave Pakula - Cupertino CA, US
Matthew Hill - Cupertino CA, US
Ethan Larry Huwe - Perham MN, US
Fletcher Rothkopf - Cupertino CA, US
Richard Hung Minh Dinh - Cupertino CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H04M 1/00
G08B 5/22
US Classification:
455567
Abstract:
Methods and apparatuses are disclosed that allow an electronic device to autonomously adapt one or more user alerts to the current operating environment of the electronic device. For example, some embodiments may include a method comprising providing a plurality of alert devices in an electronic device, determining an operating environment of the electronic device using a sensor of the electronic device, and actuating at least one of the plurality of alert devices that corresponds to the determined operating environment.

Self Adapting Alert Device

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US Patent:
20130335217, Dec 19, 2013
Filed:
Aug 21, 2013
Appl. No.:
13/972708
Inventors:
Matthew Hill - Cupertino CA, US
Ethan Larry Huwe - Perham MN, US
Fletcher R. Rothkopf - Cupertino CA, US
Richard Hung Minh Dinh - Cupertino CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
G08B 23/00
US Classification:
340517
Abstract:
Methods and apparatuses are disclosed that allow an electronic device to autonomously adapt one or more user alerts to the current operating environment of the electronic device. For example, some embodiments may include a method comprising providing a plurality of alert devices in an electronic device, determining an operating environment of the electronic device using a sensor of the electronic device, and actuating at least one of the plurality of alert devices that corresponds to the determined operating environment.

Wireless Listening Device

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US Patent:
20220217462, Jul 7, 2022
Filed:
Oct 7, 2021
Appl. No.:
17/496748
Inventors:
- CUPERTINO CA, US
Arun D. Chawan - Berkeley CA, US
Julia C. Canning - Sunnyvale CA, US
Michael B. Minerbi - San Francisco CA, US
Pengchuan Wang - San Jose CA, US
Kyle Tse - Fremont CA, US
Brian R. Twehues - San Jose CA, US
Sean T. Bong - San Jose CA, US
Eric X. Zhou - San Jose CA, US
Ethan L. Huwe - Campbell CA, US
Scott C. Grinker - Belmont CA, US
Haochuan Sang - Santa Clara CA, US
Martin Kuster - Los Gatos CA, US
Sean J. Docherty - Mississauga, CA
Ryan Buck - San Francisco CA, US
Yuta Kuboyama - San Mateo CA, US
International Classification:
H04R 1/10
H04R 1/22
Abstract:
A portable acoustic device comprising: a device housing that defines an internal cavity, the device housing comprising a speaker housing portion and a stem portion extending away from the speaker housing portion; a first acoustic port formed through a wall of the speaker housing; an audio driver disposed within the speaker housing portion and aligned to emit sound through the acoustic first port; a battery disposed within the speaker housing portion and positioned an opposite side of the audio driver than the acoustic port; an antenna disposed in the stem; a user input region disposed along the stem; and a system in a chip disposed in the stem, the system in a chip comprising: a processor that controls operation of the portable wireless acoustic device, charging circuitry, an accelerometer, a wireless communication controller, support components for the antenna and support components for the user input region.

Eartips For Coupling Via Wireform Attachment Mechanisms

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US Patent:
20230088030, Mar 23, 2023
Filed:
Nov 22, 2022
Appl. No.:
17/992332
Inventors:
- CUPERTINO CA, US
Jason C. Della Rosa - Morgan Hill CA, US
Samuel G. Parker - Woodside CA, US
Benjamin A. Cousins - Campbell CA, US
Ethan L. Huwe - Davis CA, US
Assignee:
APPLE INC. - CUPERTINO CA
International Classification:
H04R 1/10
G01V 3/08
A45C 11/00
A45C 13/00
E05F 1/12
E05F 3/20
H01F 7/02
H05K 5/00
H05K 5/02
H05K 5/03
H04R 1/02
Abstract:
Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

Conductive Features On System-In-Package Surfaces

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US Patent:
20230078536, Mar 16, 2023
Filed:
Jun 3, 2022
Appl. No.:
17/832346
Inventors:
- Cupertino CA, US
Bilal Mohamed Ibrahim Kani - Singapore, SG
Chang Liu - San Jose CA, US
Ethan L. Huwe - Davis CA, US
Jeffrey J. Terlizzi - San Francisco CA, US
Jerzy S. Guterman - Sunnyvale CA, US
Jue Wang - San Jose CA, US
Kishore N. Renjan - Singapore, SG
Kyusang Kim - Singapore, SG
Lan H. Hoang - San Jose CA, US
Mandar S. Painaik - Cupertino CA, US
Manoj Vadeentavida - Singapore, SG
Sarah B. Gysbers - Santa Clara CA, US
Takayoshi Katahira - San Jose CA, US
Zhiqi Wang - Shanghai, CN
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 1/02
H05K 1/11
H01Q 1/22
H01Q 1/36
Abstract:
System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

Eartips For In-Ear Listening Devices

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US Patent:
20210243514, Aug 5, 2021
Filed:
Apr 19, 2021
Appl. No.:
17/234441
Inventors:
- Cupertino CA, US
Shota Aoyagi - San Francisco CA, US
Timothy E. Emmott - San Francisco CA, US
Ethan L. Huwe - Davis CA, US
Mitchell R. Lerner - San Francisco CA, US
Sean T. McIntosh - Cupertino CA, US
Yi-Fang D. Tsai - Mountain View CA, US
Jason C. Della Rosa - Morgan Hill CA, US
Patrick W. Sheppard - San Francisco CA, US
Samuel G. Parker - Woodside CA, US
David J. Feathers - San Jose CA, US
Brian R. Twehues - Campbell CA, US
Daniel Strongwater - San Francisco CA, US
International Classification:
H04R 1/10
Abstract:
Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

Eartips For Coupling Via Wireform Attachment Mechanisms

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US Patent:
20210211796, Jul 8, 2021
Filed:
Mar 19, 2021
Appl. No.:
17/207497
Inventors:
- Cupertino CA, US
Jason C. Della Rosa - Morgan Hill CA, US
Samuel G. Parker - Woodside CA, US
Benjamin A. Cousins - Campbell CA, US
Ethan L. Huwe - Davis CA, US
International Classification:
H04R 1/10
G01V 3/08
A45C 11/00
A45C 13/00
E05F 1/12
E05F 3/20
H01F 7/02
H05K 5/00
H05K 5/02
H05K 5/03
H04R 1/02
Abstract:
Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

Windscreen Mesh

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US Patent:
20210099778, Apr 1, 2021
Filed:
Jun 15, 2020
Appl. No.:
16/901937
Inventors:
- Cupertino CA, US
Jarrett B. Lagler - San Francisco CA, US
Brian R. Twehues - San Jose CA, US
Ethan L. Huwe - Campbell CA, US
Mei Zhang - Cupertino CA, US
International Classification:
H04R 1/02
Abstract:
An acoustic mesh comprising a first portion that is acoustically closed; and a second portion that surrounds the first portion and is acoustically open, wherein a surface area of the second portion is at least one percent a total surface area of the acoustic mesh.
Ethan L Huwe from Woodinville, WA, age ~37 Get Report