US Patent:
20210254327, Aug 19, 2021
Inventors:
- Atlanta GA, US
Erik Lee Skov - Stanley NC, US
International Classification:
E04B 1/343
E04H 1/12
E04B 7/18
E04B 2/58
Abstract:
Modular enclosures, structures, and components thereof are provided herein. A modular enclosure may include a plurality of enclosure panels and a dormer. A modular assembly may include first and second panels, an elongated structural reinforcing member, and a connector pin connecting the first and second panels. Another modular assembly may include a molded panel including an elongated channel, an elongated reinforcing member positioned in the channel, and at least one fastener configured to retain the elongated reinforcing member within the channel. The elongated reinforcing member may include pins to be retained within blind bores of the elongated channel.