Erik Reddington

6652731, Nov 25, 2003

Oct 2, 2001

09/970271

Andrew J. Cobley - Coventry, GB
Mark J. Kapeckas - Marlborough MA
Erik Reddington - Ashland MA
Wade Sonnenberg - Edgartown MA
Leon R. Barstad - Raynham MA
Thomas Buckley - Dedham MA

Shipley Company, L.L.C. - Marlborough MA

C25D 338

205296, 106 126

A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

6736954, May 18, 2004

Oct 2, 2001

09/970348

Andrew J. Cobley - Coventry, GB
Mark J. Kapeckas - Marlborough MA
Erik Reddington - Ashland MA
Wade Sonnenberg - Edgartown MA
Leon R. Barstad - Raynham MA
Thomas Buckley - Dedham MA

Shipley Company, L.L.C. - Marlborough MA

C25D 356

205238, 205239, 205241, 205242, 205247, 205252, 205253, 205255, 205257, 205259, 205261, 205263, 205264, 205265, 205266, 205267, 205269, 205291, 205300, 205302, 106 125, 106 126, 106 127, 106 128

A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

6773573, Aug 10, 2004

Oct 2, 2001

09/970224

David R. Gabe - Loughborough, GB
Andrew J. Cobley - Coventry, GB
Leon R. Barstad - Raynham MA
Mark J. Kapeckas - Marlborough MA
Erik Reddington - Ashland MA
Wade Sonnenberg - Edgartown MA
Thomas Buckley - Dedham MA

Shipley Company, L.L.C. - Marlborough MA

C25D 338

205296, 205248, 205267, 205238, 205263, 205255, 205257, 205259, 205264, 205265, 205269, 205261, 106 125, 106 126, 106 127, 106 128

A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

6911068, Jun 28, 2005

Oct 2, 2001

09/970171

Andrew J. Cobley - Conventry, GB
Mark J. Kapeckas - Marlborough MA, US
Erik Reddington - Ashland MA, US
Wade Sonnenberg - Edgartown MA, US
Leon R. Barstad - Raynham MA, US
Thomas Buckley - Dedham MA, US

Shipley Company, L.L.C. - Marlborough MA

C23C016/00
C23C018/00
C25D003/00
C25D003/10
C25D003/50

106 125, 106 126, 106 127, 106 128, 106 129, 205261, 205264, 205265, 205267, 205281, 205290, 205296

A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

7384535, Jun 10, 2008

Apr 24, 2004

10/831726

Wade Sonnenberg - Edgartown MA, US
Leon R. Barstad - Raynham MA, US
Raymond Cruz - Watertown MA, US
Gary Hamm - Medford MA, US
Mark J. Kapeckas - Marlborough MA, US
Erik Reddington - Ashland MA, US
Katie Price - Stoneham MA, US
Thomas Buckley - Rocky Hill CT, US
Trevor Goodrich - Windsor MA, US

Rohm and Haas Electronic Materials LLC - Marlborough MA

G01N 27/42

205775, 205 81, 205787, 204434

Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.

8012334, Sep 6, 2011

Apr 2, 2008

12/080522

Erik Reddington - Ashland MA, US
Gonzalo Urrutia Desmaison - Berlin, DE
Zukhra I. Niazimbetova - Westborough MA, US
Donald E. Cleary - Littleton MA, US
Mark Lefebvre - Hudson NH, US

Rohm and Haas Electronic Materials LLC - Marlborough MA

C25D 3/56
C25D 3/62
C25D 3/00
C25D 3/46
C25D 3/50
C25D 3/48
C25D 3/12
C25D 3/26
C25D 3/28
C25D 3/38
C25D 3/30
C23C 18/40

205239, 205238, 205241, 205242, 205247, 205255, 205259, 205261, 205263, 205264, 205265, 205266, 205267, 205271, 205280, 205291, 205296, 205300, 205302, 205303, 106 125, 106 126, 106 127, 106 128

Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

8048284, Nov 1, 2011

Apr 2, 2008

12/080484

Erik Reddington - Ashland MA, US
Gonzalo Urrutia Desmaison - Berlin, DE
Zukhra I. Niazimbetova - Westborough MA, US
Donald E. Cleary - Littleton MA, US
Mark Lefebvre - Hudson NH, US

Rohm and Haas Electronic Materials LLC - Marlborough MA

C25D 3/56
C25D 3/58
C25D 3/62
C25D 3/60
C25D 3/00
C25D 3/46
C25D 3/50
C25D 3/48
C23C 16/40
C23C 18/40
C23C 18/36
C23C 18/44

205238, 205239, 205241, 205242, 205247, 205252, 205253, 205255, 205257, 205259, 205261, 205263, 205264, 205265, 205266, 205267, 205271, 205276, 205280, 205291, 205296, 205300, 205302, 205303, 106 125, 106 126, 106 127, 106 128

Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

8268158, Sep 18, 2012

Aug 11, 2011

13/207658

Zukhra I. Niazimbetova - Westboro MA, US
Elie H. Najjar - Norwood MA, US
Maria Anna Rzeznik - Shrewsbury MA, US
Erik Reddington - Ashland MA, US

Rohm and Haas Electronic Materials LLC - Marlborough MA

C08G 59/14
C09K 3/00
C23C 18/38
C25D 3/38

205297, 106 126, 25218311, 528117

Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.