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Erik Mitterhofer Phones & Addresses

  • Dedham, MA
  • Chestnut Hill, MA
  • 225 Rivermoor St, West Roxbury, MA 02132

Work

Company: American banknote corporation Feb 2008 Position: Vice president research & development

Education

School / High School: Technologisches Gewerbemuseum 1992 to 1993 Specialities: Plastic Waste Recycling

Industries

Printing

Resumes

Resumes

Erik Mitterhofer Photo 1

Vice President – Research & Development At American Banknote Corporation

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Position:
Vice President Research & Development at American Banknote Corporation
Location:
Greater Boston Area
Industry:
Printing
Work:
American Banknote Corporation since Feb 2008
Vice President Research & Development

Austria Card Jul 2006 - Jan 2008
Sales Manager - ID & Government

Austria Card Jan 2001 - Jul 2006
Head of Process Technology and later Product Manager

Roehrig High Tech Plastics AG Jun 2000 - Nov 2000
Sales- & Project Manager

Cincinnati Milacron Austria Feb 1997 - May 2000
Sales- & Project Manager
Education:
Technologisches Gewerbemuseum 1992 - 1993
Technologisches Gewerbemuseum 1987 - 1992
Eng., Plastics Engineering
PARTEC Qld Australia 1996

Business Records

Name / Title
Company / Classification
Phones & Addresses
Erik Mitterhofer
VP Research & Technology, Vp Research And
ABNOTE USA, INC
Mfg Unsupported Plastic Film/Sheet · Mfg Unsupported Plastic Film/Sheet Whol Nondurable Goods · All Other Plastics Prod Mfg
West Roxbury, MA 02132
225 Rivermoor St, West Roxbury, MA 02132
(617) 325-9600, (617) 327-1235

Publications

Us Patents

Cover And Method Of Manufacturing The Same

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US Patent:
20100295286, Nov 25, 2010
Filed:
May 13, 2010
Appl. No.:
12/800474
Inventors:
Keith E. Goldstein - Framingham MA, US
Erik Mitterhofer - Dedham MA, US
International Classification:
B42D 3/02
B29C 44/06
US Classification:
281 29, 156 78
Abstract:
An electronic cover for a passport, booklet or the like includes an electronic device and a layer of cover material that are bonded together by a fill-up adhesive layer, the electronic device preferably being in the form of an RFID inlay that includes a substrate, an antenna coupled to the substrate and an integrated circuit (IC) chip module conductively coupled to the antenna. During manufacture of the cover, the fill-up adhesive layer is applied to at least one of the electronic device and the layer of cover material. Immediately thereafter, the electronic device and the layer of cover material are held spaced apart from one another a predefined distance so as to define a void therebetween. Through a suitable trigger, the fill-up adhesive layer expands to fill in the entire void and subsequently cures to bond the electronic device to the layer of cover material.
Erik Mitterhofer from Dedham, MA, age ~54 Get Report