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Eric Distefano

from Livermore, CA
Age ~64
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Also known as:
Eric Di Distefano, Eric Destefano, Kendric Distefano, Harrison Distefano, Eric Di Stefano, Distefano Harrison
Phone and address:
1535 Frankfurt Way, Livermore, CA 94550
(925) 455-4339
Related to:
Andrew A Cesanek, 28Christina Distefano, 28Laura Distefano, 40Stefano Di, 64Jonathan Distefano, 32
Connected to:
Alex C Distefano, 42Alexandra E Distefano, 29Aury A Distefano, 68Carmen J Distefano, 92Demetrius Distefano, 52Elisa N Distefano, 58Elvira G Distefano, 79Giuseppe Distefano, 56James Distefanis, 78Jeremy M Distefano, 50

Eric Distefano Phones & Addresses

  • 1535 Frankfurt Way, Livermore, CA 94550 (925) 455-4339
  • Mickleton, NJ
  • 12314 Inletridge Dr, Maryland Heights, MO 63043 (314) 205-1291
  • Santa Ana, CA
  • Irvine, CA
  • Laguna Beach, CA
  • Alameda, CA

Resumes

Resumes

Eric Distefano Photo 1

Principal Engineer

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Location:
Livermore, CA
Industry:
Computer Hardware
Work:
Macdonnell Douglas Aerospace Corporation Feb 1987 - Feb 1998
Egineer
Intel Corporation Feb 1987 - Feb 1998
Principal Engineer
United States Air Force Feb 1983 - Feb 1987
Engineer
Education:
Lehigh University
Bachelors, Bachelor of Science, Chemical Engineering Uc Irvine
Master of Science, Masters, Mechanical Engineering
Skills:
Design of Experiments
Engineering
Simulations
Failure Analysis
Systems Engineering
R&D
Engineering Management
Eric Distefano Photo 2

Eric Distefano

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Publications

Us Patents

Vapor Chamber System For Cooling Mobile Computing Systems

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US Patent:
6437983, Aug 20, 2002
Filed:
Jun 29, 2001
Appl. No.:
09/895507
Inventors:
Sridhar V. Machiroutu - Santa Clara CA
Eric Distefano - Livermore CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05H 720
US Classification:
361700, 16510426, 16510433, 174 152, 257715, 361701
Abstract:
A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die, the liquid is vaporized in the vapor chamber generating vapor. The vapor flows through the MPs to condensation ends of the MPs.

Mobile Computer Having A Housing With Openings For Cooling

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US Patent:
6459573, Oct 1, 2002
Filed:
Jun 28, 2000
Appl. No.:
09/606793
Inventors:
Eric DiStefano - Livermore CA
Krishna Seshan - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 120
US Classification:
361687, 361680, 361683, 400682
Abstract:
A mobile computer comprising a lower panel, a top panel, side panels, a plurality of keyboard keys and a computer screen. The lower panel can be located on a horizontal surface. The top panel is vertically spaced from the lower panel. The side panels are located between the lower panel and the top panel. The panels define a housing. The top and side panels, while remaining attached to the lower panel, are movable relative to the lower panel between a lower position and an elevated position wherein a gap opens up between the side panels and the lower panel. The keys are located on the housing. The computer screen is mounted to the housing.

Direct Heatpipe Attachment To Die Using Center Point Loading

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US Patent:
6469893, Oct 22, 2002
Filed:
Sep 29, 2000
Appl. No.:
09/675314
Inventors:
Kris Frutschy - Phoenix AZ
Ravi Prasher - Phoenix AZ
Eric Distefano - Livermore CA
Ajit Sathe - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361700, 165 802, 16510433, 174 152, 257715, 257719, 361704
Abstract:
An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Low Thermal Resistance Interface For Attachment Of Thermal Materials To A Processor Die

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US Patent:
6570764, May 27, 2003
Filed:
Dec 29, 1999
Appl. No.:
09/474791
Inventors:
Rakesh Bhatia - Austin TX
Eric DiStefano - Livermore CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361705, 174 163, 361719
Abstract:
A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Mobile Computer Having A Housing With Openings For Cooling

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US Patent:
6577502, Jun 10, 2003
Filed:
Jun 28, 2000
Appl. No.:
09/605918
Inventors:
Eric DiStefano - Livermore CA
Krishna Seshan - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 120
US Classification:
361687, 361683, 361693
Abstract:
A mobile computer comprising a lower panel, a top panel, side panels, an electrical computer component, a plurality of keyboard keys, and a computer screen. The lower panel can be located over a horizontal surface. The top panel is vertically spaced from the lower panel. The side panels extend between the lower panel and the top panel. The panels define a housing. An air inlet opening is formed into the housing and an air outlet opening is formed at a higher elevation than the air inlet opening out of the housing. The electrical computer component is located within the housing. Power up of the component causes heating thereof. Air follows a natural convection path being through the air inlet opening into the housing, over the component, and out of the housing through the air outlet opening. The keys are located on the housing. The computer screen is mounted to the housing.

Computer System Having A Refrigeration Cycle Utilizing An Adsorber/Desorber For Purposes Of Compression

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US Patent:
6595022, Jul 22, 2003
Filed:
Jun 27, 2001
Appl. No.:
09/894192
Inventors:
Himanshu Pokharna - San Jose CA
Eric Distefano - Livermore CA
Joseph D. Walters - Santa Clara CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
F25B 1708
US Classification:
62480, 62141, 361688
Abstract:
A computer system is described having a refrigeration cycle for a logic processor each utilizes first and second refrigeration cycles, each including a respective adsorber/desorber. Each adsorber/desorber is alternatingly cooled and heated. A liquid is adsorbed into the adsorber/desorber when being cooled and desorbed when the adsorber/desorber is heated. When the liquid is desorbed from the adsorber/desorber, and a checkvalve is closed, a pressure of the liquid increases. The adsorber/desorber together with the checkvalve act as a compressor in the respective refrigeration cycle. Heating and cooling is alternated so that one adsorber/desorber always adsorbs liquid while the other adsorber/desorber desorbes liquid. Thermal swings of the logic processor are thereby avoided.

Direct Heatpipe Attachment To Die Using Center Point Loading

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US Patent:
6625022, Sep 23, 2003
Filed:
Sep 21, 2001
Appl. No.:
09/962954
Inventors:
Kris Frutschy - Phoenix AZ
Ravi Prasher - Phoenix AZ
Eric Distefano - Livermore CA
Ajit Sathe - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361700, 165 802, 16510433, 174 152, 257715, 257719, 361704
Abstract:
An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Increased Thermal Capability Of Portable Electronic Device In Stationary Or Docked Mode

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US Patent:
6674640, Jan 6, 2004
Filed:
Jul 2, 2001
Appl. No.:
09/895465
Inventors:
Himanshu Pokharna - San Jose CA
Eric Distefano - Livermore CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 721
US Classification:
361687, 361686, 454184, 16510433, 16510432
Abstract:
A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.
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Eric Distefano from Livermore, CA, age ~64 Get Report