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Ebrahim Abunasrah Phones & Addresses

  • 3 Beeson Ct, Little Rock, AR 72223
  • 1501 Rahling Rd, Little Rock, AR 72223 (501) 448-2514
  • West Helena, AR
  • North Little Rock, AR

Work

Company: Molex Apr 2012 Address: Dongguan, China Position: Engineering manager (expat)

Education

Degree: Masters School / High School: University of Arkansas at Little Rock 2008 to 2010 Specialities: Systems Engineering

Skills

Electronics • Engineering • Manufacturing • Electrical Engineering • Engineering Management • Pcb Design • Cross Functional Team Leadership • Product Development • Product Management • Electricians • Six Sigma • Design For Manufacturing

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Ebrahim Abunasrah Photo 1

Vice President, Data Center Products

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Location:
Little Rock, AR
Industry:
Electrical/Electronic Manufacturing
Work:
Molex - Dongguan, China since Apr 2012
Engineering Manager (Expat)

Molex Oct 2010 - Apr 2012
Electrical Engineer

Molex Oct 2007 - Oct 2010
Associate Electrical Engineer
Education:
University of Arkansas at Little Rock 2008 - 2010
Masters, Systems Engineering
University of Arkansas at Little Rock 2008 - 2010
Masters, Business Administration
University of Arkansas at Little Rock 2005 - 2008
Bachelor, Systems Engineering, Telecommunications
Skills:
Electronics
Engineering
Manufacturing
Electrical Engineering
Engineering Management
Pcb Design
Cross Functional Team Leadership
Product Development
Product Management
Electricians
Six Sigma
Design For Manufacturing

Business Records

Name / Title
Company / Classification
Phones & Addresses
Ebrahim Abunasrah
COPPER VELOCITY, LLC
7 Sezanne Cv, Little Rock, AR 72223

Publications

Us Patents

High Speed Bypass Cable For Use With Backplanes

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US Patent:
20170365943, Dec 21, 2017
Filed:
Aug 11, 2017
Appl. No.:
15/674656
Inventors:
- Lisle IL, US
Brian Keith Lloyd - Maumelle AR, US
Ebrahim Abunasrah - Little Rock AR, US
Rehan Khan - Little Rock AR, US
Javier Resendez - Streamwood IL, US
Michael Rost - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 12/70
H01R 13/6474
H01R 13/514
H01R 13/6471
H01R 13/6592
H01R 13/6587
Abstract:
A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.

High Speed Bypass Cable For Use With Backplanes

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US Patent:
20170302011, Oct 19, 2017
Filed:
Jul 5, 2017
Appl. No.:
15/641777
Inventors:
- Lisle IL, US
Brian Keith LLOYD - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Javier RESENDEZ - Streamwood IL, US
Michael ROST - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 12/70
H01R 13/6474
H01R 13/514
H01R 13/6471
H01R 13/6592
H01R 13/6587
Abstract:
A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.

Data Connector

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US Patent:
20170207549, Jul 20, 2017
Filed:
Jan 20, 2017
Appl. No.:
15/411558
Inventors:
- Palo Alto CA, US
Ebrahim Abunasrah - Little Rock AR, US
International Classification:
H01R 4/04
H01R 24/60
Abstract:
A differential data cable for high-speed signals includes a connector PCB with angled pads cable connection pads connected to a pair of differential data cable conductors, wherein the symmetrical angled configuration minimizes lead lengths, interface discontinuities, and common mode imbalance. A third pad may be connected to a return signal wire. The connector PCB may have a similar arrangement on the other side, and may have a ground plane in between. The cable may be placed over the ground plane and away from the edge. Pads may have a bump to shorten wire lengths. Wires are glued to the bumps using a UV-curable adhesive. Wires are positioned in an angle with the PCB.

High Speed Bypass Cable For Use With Backplanes

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US Patent:
20170162960, Jun 8, 2017
Filed:
Feb 15, 2017
Appl. No.:
15/433749
Inventors:
- Lisle IL, US
Brian Keith LLOYD - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Javier RESENDEZ - Streamwood IL, US
Michael ROST - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 12/70
H01R 13/6592
H01R 13/6474
H01R 13/6587
H01R 13/514
H01R 13/6471
Abstract:
A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.

High Speed Bypass Cable Assembly

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US Patent:
20170125950, May 4, 2017
Filed:
Jan 12, 2017
Appl. No.:
15/404942
Inventors:
- Lisle IL, US
Christopher David HIRSCHY - Conway AR, US
Munawar AHMAD - Maumelle AR, US
Eran J. JONES - Conway AR, US
Stephen W. HAMBLIN - Little Rock AR, US
Darian Ross SCHULZ - Little Rock AR, US
Todd David WARD - Maumelle AR, US
Gregory B. WALZ - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 13/6461
H01R 13/6592
Abstract:
A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.

High Speed Bypass Cable For Use With Backplanes

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US Patent:
20170033478, Feb 2, 2017
Filed:
Oct 11, 2016
Appl. No.:
15/290638
Inventors:
- Lisle IL, US
Brian Keith LLOYD - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Javier RESENDEZ - Streamwood IL, US
Michael ROST - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 12/70
H01R 13/6592
H01R 13/6477
H01R 13/6587
H01R 13/514
H01R 13/6471
Abstract:
A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.

Connection System For Use With A Chip

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US Patent:
20160268714, Sep 15, 2016
Filed:
May 23, 2016
Appl. No.:
15/162264
Inventors:
- Lisle IL, US
Brian Keith LLOYD - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Javier RESENDEZ - Streamwood IL, US
Michael ROST - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 12/70
H01R 13/6473
H01R 13/6461
H01R 13/6592
Abstract:
A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.

Connection System For Use With A Chip

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US Patent:
20160111825, Apr 21, 2016
Filed:
Dec 17, 2015
Appl. No.:
14/973095
Inventors:
- Lisle IL, US
Brian Keith LLOYD - Maumelle AR, US
Ebrahim ABUNASRAH - Little Rock AR, US
Rehan KHAN - Little Rock AR, US
Javier RESENDEZ - Streamwood IL, US
Michael ROST - Lisle IL, US
Assignee:
Molex, LLC - Lisle IL
International Classification:
H01R 13/6473
H01R 13/6592
H01R 13/6461
H01R 12/70
Abstract:
A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
Ebrahim H Abunasrah from Little Rock, AR, age ~38 Get Report