Dong Li

6812153, Nov 2, 2004

Apr 30, 2002

10/137132

Zhong Qiang Hua - Saratoga CA
Dong Qing Li - Santa Clara CA
Zhengquan Tan - Cupertino CA
Zhuang Li - San Jose CA
Michael Chiu Kwan - Redwood City CA
Bruno Geoffrion - San Jose CA
Padmanabhan Krishnaraj - San Francisco CA

Applied Materials Inc. - Santa Clara CA

H01L 21302

438706, 438710, 438712, 427569

A method of depositing a high density plasma silicon oxide layer having improved gapfill capabilities. In one embodiment the method includes flowing a process gas consisting of a silicon-containing source, an oxygen-containing source and helium into a substrate processing chamber and forming a plasma from the process gas. The ratio of the flow rate of the helium with respect to the combined flow rate of the silicon source and oxygen source is between 0. 5:1 and 3. 0:1 inclusive. In one particular embodiment, the process gas consists of monosilane (SiH ), molecular oxygen (O ) and helium.

7064077, Jun 20, 2006

Oct 1, 2004

10/956469

Zhong Qiang Hua - Saratoga CA, US
Dong Qing Li - Santa Clara CA, US
Zhengquan Tan - Cupertino CA, US
Zhuang Li - San Jose CA, US
Michael Chiu Kwan - Redwood City CA, US
Bruno Geoffrion - San Jose CA, US
Padmanabhan Krishnaraj - San Francisco CA, US

Applied Materials - Santa Clara CA

H01L 21/302

438715, 438706, 438714, 427569

A method of depositing a high density plasma silicon oxide layer having improved gapfill capabilities. In one embodiment the method includes flowing a process gas consisting of a silicon-containing source, an oxygen-containing source and helium into a substrate processing chamber and forming a plasma from the process gas. The ratio of the flow rate of the helium with respect to the combined flow rate of the silicon source and oxygen source is between 0. 5:1 and 3. 0:1 inclusive. In one particular embodiment, the process gas consists of monosilane (SiH), molecular oxygen (O) and helium.

7205240, Apr 17, 2007

Jun 4, 2003

10/456611

M. Ziaul Karim - San Jose CA, US
Bikram Kapoor - Santa Clara CA, US
Anchuan Wang - Fremont CA, US
Dong Qing Li - Santa Clara CA, US
Katsunari Ozeki - Chiba, JP
Manoj Vellaikal - Santa Clara CA, US
Zhuang Li - San Jose CA, US

Applied Materials, Inc. - Santa Clara CA

C23C 16/00

438694, 438695, 438692, 438424, 438435, 42725523, 42725528, 42725537, 216 59, 216 67, 216 79, 15634524, 15634533, 15634548, 118696, 118697, 118723 I, 118723 IR

A gapfill process is provided using cycling of HDP-CVD deposition, etching, and deposition step. The fluent gas during the first deposition step includes an inert gas such as He, but includes Hduring the remainder deposition step. The higher average molecular weight of the fluent gas during the first deposition step provides some cusping over structures that define the gap to protect them during the etching step. The lower average molecular weight of the fluent gas during the remainder deposition step has reduced sputtering characteristics and is effective at filling the remainder of the gap.

7440229, Oct 21, 2008

Aug 6, 2004

10/912245

Yoshitaka Sasaki - Santa Clara CA, US
Lijie Guan - Milpitas CA, US
Hiroyuki Ito - Sunnyvale CA, US
Dong Hong Li - Fremont CA, US

Headway Technologies, Inc. - Milpitas CA

G11B 5/127

36012522

A thin-film magnetic head has a laminated construction comprising a main pole layer having a magnetic pole tip on a side of the medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip forming a recording gap layer, on the side of the medium-opposing surface, and a thin-film coil wound around at least a portion of the write shield layer. The thin-film magnetic head has an upper yoke pole layer having a larger size than the portion of the main pole layer which is more distant from the medium-opposing surface than the recording gap layer, wherein the upper yoke pole layer is joined to the side of the main pole layer which is near the thin-film coil.

7542614, Jun 2, 2009

Jun 6, 2007

11/758910

Amnon Silverstein - Mountain View CA, US
Sheng Lin - Sunnyvale CA, US
Dong Li - Cupertino CA, US

Micron Technology, Inc. - Boise ID

G06K 9/36

382232

Apparatus, systems, and methods disclosed herein may estimate the magnitude of relative motion between a scene and an image capture device used to capture the scene. Some embodiments may utilize discrete cosine transform and/or Sobel gradient techniques to identify one or more blocks of pixels in an originating calibration image frame. Matching blocks of pixels may be located in a successive calibration image frame. Motion vectors originating at one calibration frame and terminating at the other calibration frame may be calculated. The magnitude of relative motion derived thereby may be used to adjust image capture parameters associated with the image capture device, including exposure settings.

7599566, Oct 6, 2009

Jun 6, 2007

11/758815

Amnon Silverstein - Mountain View CA, US
Sheng Lin - Sunnyvale CA, US
Dong Li - Cupertino CA, US

Aptina Imaging Corporation - George Town

G06K 9/36

382238

Apparatus, systems, and methods disclosed herein may estimate the magnitude of relative motion between a scene and an image capture device used to capture the scene. Some embodiments may utilize discrete cosine transform and/or Sobel gradient techniques to identify one or more blocks of pixels in an originating calibration image frame. Matching blocks of pixels may be located in a successive calibration image frame. Motion vectors originating at one calibration frame and terminating at the other calibration frame may be calculated. The magnitude of relative motion derived thereby may be used to adjust image capture parameters associated with the image capture device, including exposure settings.

7718218, May 18, 2010

Sep 10, 2008

12/232065

Yoshitaka Sasaki - Santa Clara CA, US
Lijie Guan - Milpitas CA, US
Hiroyuki Ito - Sunnyvale CA, US
Dong Hong Li - Fremont CA, US

Headway Technologies, Inc. - Milpitas CA

G11B 5/127
G11B 5/17
G11B 5/187

427130, 427355, 4273722, 427402

A thin-film magnetic head has a laminated construction comprising a main pole layer having a magnetic pole tip on a side of the medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip forming a recording gap layer, on the side of the medium-opposing surface, and a thin-film coil wound around at least a portion of the write shield layer. The thin-film magnetic head has an upper yoke pole layer having a larger size than the portion of the main pole layer which is more distant from the medium-opposing surface than the recording gap layer, wherein the upper yoke pole layer is joined to the side of the main pole layer which is near the thin-film coil.

7924316, Apr 12, 2011

Mar 14, 2007

11/717954

Amnon Silverstein - Mountain View CA, US
Sheng Lin - Sunnyvale CA, US
Dong Li - Cupertino CA, US

Aptina Imaging Corporation - George Town

H04N 5/228

3482084

Apparatus, systems, and methods disclosed herein may estimate the magnitude of relative motion between a scene and an image capture device used to capture the scene. Some embodiments may utilize discrete cosine transform and/or Sobel gradient techniques to identify one or more blocks of pixels in an originating calibration image frame. Matching blocks of pixels may be located in a successive calibration image frame. Motion vectors originating at one calibration frame and terminating at the other calibration frame may be calculated. The magnitude of relative motion derived thereby may be used to adjust image capture parameters associated with the image capture device, including exposure settings.