Inventors:
David Welch - Menlo Park CA, US
Vincent Dominic - Fremont CA, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Windsor Mill MD, US
Matthew Mitchell - Bethesda MD, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US
Assignee:
Infinera Corporation - Sunnyvale CA
International Classification:
G02B006/12
Abstract:
A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.