Donald J Pavinski

20050025409, Feb 3, 2005

May 25, 2004

10/852988

David Welch - Menlo Park CA, US
Vincent Dominic - Fremont CA, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Windsor Mill MD, US
Matthew Mitchell - Bethesda MD, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US

Infinera Corporation - Sunnyvale CA

G02B006/12

385014000

A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

20080031626, Feb 7, 2008

Oct 9, 2007

11/869420

David Welch - Menlo Park CA, US
Vincent Dominic - Dayton OH, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Charleston SC, US
Matthew Mitchell - Sunnyvale CA, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US

INFINERA CORPORATION - Sunnyvale CA

H04J 14/02

398079000

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

20110007486, Jan 13, 2011

Jul 7, 2009

12/499067

Donald J. Pavinski - West Pittston PA, US
August Spannagel - San Francisco CA, US
Charles H. Joyner - Sunnyvale CA, US
Peter W. Evans - Mountain House CA, US
Matthew Fisher - Mountain View CA, US
Mark J. Missey - San Jose CA, US

H05K 7/00

361760

Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

20040067006, Apr 8, 2004

Dec 11, 2002

10/317935

David Welch - Menlo Park CA, US
Vincent Dominic - Fremont CA, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Windsor Mill MD, US
Matthew Mitchell - Bethesda MD, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US

G02B006/12

385/014000

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

20190158183, May 23, 2019

Jan 7, 2019

16/241625

- Sunnyvale CA, US
Michael Reffle - Center Valley PA, US
Xiaofeng Han - Allentown PA, US
Mehrdad Ziari - Pleasanton CA, US
Vikrant Lal - Sunnyvale CA, US
Peter W. Evans - Mountain House CA, US
Donald J. Pavinski - West Pittston PA, US
Jie Tang - Fogelsville PA, US
David Coult - Oley PA, US

H04B 10/40
H04B 10/50
H04J 14/06
G02B 6/42

A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

20180138981, May 17, 2018

Dec 20, 2017

15/849390

- Sunnyvale CA, US
Michael Reffle - Center Valley PA, US
Xiaofeng Han - Allentown PA, US
Mehrdad Ziari - Pleasanton CA, US
Vikrant Lal - Sunnyvale CA, US
Peter W. Evans - Mountain House CA, US
Fred A. Kish - Palo Alto CA, US
Donald J. Pavinski - West Pittston PA, US
Jie Tang - Fogelsville PA, US
David Coult - Oley PA, US

H04B 10/40
H04J 14/06
H04B 10/50
G02B 6/42
G02B 6/36
G02B 6/35

A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

20150318952, Nov 5, 2015

Apr 29, 2015

14/699907

- Sunnyvale CA, US
Michael Reffle - Center Valley PA, US
Xiaofeng Han - Allentown PA, US
Mehrdad Ziari - Pleasanton CA, US
Vikrant Lal - Sunnyvale CA, US
Peter W. Evans - Mountain House CA, US
Donald J. Pavinski - West Pittston PA, US
Jie Tang - Fogelsville PA, US
David Coult - Oley PA, US

H04J 14/06
H04B 10/40
H04B 10/50

A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

20150180580, Jun 25, 2015

Apr 2, 2013

13/855552

INFINERA CORP. - , US
Radhakrishnan L. Nagarajan - Cupertino CA, US
Jiaming Zhang - Macungie PA, US
Joseph Edward Riska - Macungie PA, US
Donald J. Pavinski - West Pittston PA, US
Jie Tang - Fogelsville PA, US
Timothy Butrie - Hellertown PA, US

H04B 10/50
H04B 10/516

A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.