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Donald O Nessman

from Pasadena, CA
Age ~69
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Also known as:
Donald Oscar Nessman, Donald D Nessman, Don Nessman, Donald N
Phone and address:
1365 N Michillinda Ave, Pasadena, CA 91107
(626) 351-3864
Related to:
Jesus Anguiano, 40Jaime G Ortiz, 68Martha R Ortiz, 68Vido A Artukovich, 70Angel LopezAngelica L Nessman, 63
Connected to:
Cory E Nessman, 46John C Nessman, 66Brittney A Nessmith, 39Deborah A Nessmith, 61Georgia A Nessmith, 55Peggy D Nessmith, 65Keith Nessola, 54Alexander M Nesson, 56Susan B Nesson, 62Gabrielle M Nessour, 53

Donald Nessman Phones & Addresses

  • 1365 N Michillinda Ave, Pasadena, CA 91107 (626) 351-3864
  • 165 E Sierra Madre Blvd, Sierra Madre, CA 91024 (626) 355-5443
  • Tualatin, OR
  • 2905 Carriage Way, West Linn, OR 97068
  • San Dimas, CA
  • Glendora, CA
  • Skokie, IL
  • Monrovia, CA
  • 165 E Sierra Madre Blvd APT F, Sierra Madre, CA 91024 (626) 355-5443

Work

Company: Ducommun aerostructures 2011 Address: Monrovia Position: R&d process engineer

Education

School / High School: UNIVERSITY OF CALIFORNIA IRVINE Extension 2008 to 2009 Specialities: Leadership Skills Courses

Skills

Design of Experiments • Manufacturing • R&D • Spc • Failure Analysis • Medical Devices • Engineering • Process Simulation • Cross Functional Team Leadership • Manufacturing Engineering • Product Development • Process Improvement • Fda • Testing • Lean Manufacturing • Design For Manufacturing • Materials Science • Iso • Continuous Improvement • Materials • Automation • Solidworks • Semiconductors • Injection Molding • Aerospace • Technical Documentation • Assembly Lines • Fmea • Finite Element Analysis • Systems Engineering • Yield • Value Stream Mapping • Product Design • Quality Management • Quality Assurance • V&V • Software Documentation • Root Cause Analysis • Process Engineering • Minitab

Languages

English

Ranks

Certificate: Lean Six Sigma

Emails

d***[email protected]

Industries

Medical Devices

Resumes

Resumes

Donald Nessman Photo 1

Consulting Engineer

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Location:
1365 north Michillinda Ave, Pasadena, CA 91107
Industry:
Medical Devices
Work:
Ducommun Aerostructures - Monrovia since 2011
R&D Process Engineer
Medtronic 2010 - Nov 2011
Manufacturing Process Engineer
SafeNet Mykotronx Jul 2007 - Jun 2009
PRINCIPAL MANUFACTURING ENGINEER
Spectrum Laboratories Jun 2005 - Jun 2007
ENGINEER
Xponent Photonics Oct 2003 - Nov 2004
MEMBER OF TECHNICAL STAFF / SUPERVISOR
Education:
UNIVERSITY OF CALIFORNIA IRVINE Extension 2008 - 2009
University of Illinois at Chicago 1977 - 1979
Master of Science Degree, Physics Earlham College 1973 - 1977
BS Degree, Physics COLLEGE OF THE CANYONS
Kenwood High School
Skills:
Design of Experiments
Manufacturing
R&D
Spc
Failure Analysis
Medical Devices
Engineering
Process Simulation
Cross Functional Team Leadership
Manufacturing Engineering
Product Development
Process Improvement
Fda
Testing
Lean Manufacturing
Design For Manufacturing
Materials Science
Iso
Continuous Improvement
Materials
Automation
Solidworks
Semiconductors
Injection Molding
Aerospace
Technical Documentation
Assembly Lines
Fmea
Finite Element Analysis
Systems Engineering
Yield
Value Stream Mapping
Product Design
Quality Management
Quality Assurance
V&V
Software Documentation
Root Cause Analysis
Process Engineering
Minitab
Languages:
English
Certifications:
Lean Six Sigma
The Six Sigma Way

Publications

Us Patents

Bonded Components And Component Bonding

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US Patent:
20060108396, May 25, 2006
Filed:
Sep 28, 2005
Appl. No.:
11/239658
Inventors:
Donald Nessman - Sierra Madre CA, US
Franklin Monzon - Temple City CA, US
Peter Sercel - Pasadena CA, US
International Classification:
A47J 36/02
US Classification:
228101000
Abstract:
A method for bonding first and second components to one another comprises: forming a plurality of bonding area projections on a bonding area of a first component; depositing bonding metal on the bonding area of the first component or a corresponding bonding area of a second component; positioning the first and second components with the deposited bonding metal between their respective bonding areas and in contact therewith; and urging the first and second components toward one another, thereby pressing the deposited bonding metal therebetween. The plurality of bonding area projections protrude into the deposited bonding metal after the bonding metal is pressed between the first and second components. The first and second components are bonded to one another by each adhering to bonding metal. An apparatus comprises first and second components bonded according to the disclosed method.
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Donald O Nessman from Pasadena, CA, age ~69 Get Report