A method of forming a through-via in a laminated substrate by applying a polymeric photo-absorptive layer on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate from a top of the substrate through the substrate to a bottom of the substrate. The photo-absorptive layer formed on the bottom surface of the substrate is then removed.
Multiple Frequency Processing To Minimize Manufacturing Variability Of High Aspect Ratio Micro Through-Vias
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
John J. Budnaitis - Eau Claire WI Paul J. Fischer - Eau Claire WI David A. Hanson - Altoona WI David B. Noddin - Eau Claire WI Mark F. Sylvester - Eau Claire WI William George Petefish - Eau Claire WI
Assignee:
W. L. Gore & Associates, Inc. - Newark DE
International Classification:
B32B 900 H01L 23053
US Classification:
428209
Abstract:
A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.
Multiple Frequency Processing To Minimize Manufacturing Variability Of High Aspect Ratio Micro Through-Vias
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Multiple Frequency Processing To Minimize Manufacturing Variability Of High Aspect Ratio Micro Through-Vias
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Method Of Increasing Package Reliability By Designing In Plane Cte Gradients
Mark F. Sylvester - Eau Claire WI David B. Noddin - Eau Claire WI
Assignee:
W. L. Gore & Associates, Inc. - Newark DE
International Classification:
H01L 2120
US Classification:
438584
Abstract:
A method of manufacturing a multi-layered structure includes forming first and second layers, patterning the first layer, determining a distribution of material in at least one area of the first layer, and altering the material content of one of the first and second layers in at least one of the first layer area and a corresponding area of the second layer to approximately match the material content of the first layer and second layers.
Method To Correct Astigmatism Of Fourth Yag To Enable Formation Of Sub 25 Micron Micro-Vias Using Masking Techniques
A method of forming a via in a laminated substrate by placing a first mask between an output optics of a laser and an exposed surface of a laminated substrate. The first mask has a first aperture corresponding to a location of a via in the substrate. A second mask is placed between the first mask and the output optics of the laser. The second mask has a second aperture disposed within a main beam of a laser beam output from the laser and blocks side lobes of the laser beam from reaching the exposed surface of the substrate.
Multiple Frequency Processing To Improve Electrical Resistivity Of Blind Micro-Vias
A method of forming a blind-via in a laminated substrate by forming a first conductive layer. A dielectric layer is then formed on the first conductive layer. An exposed second conductive layer is formed on the dielectric layer, with the second conductive layer having a preformed aperture. The dielectric layer is laser drilled through to the first conductive layer to form a blind-via at a location within the preformed aperture of the second conductive layer using a plurality of laser pulses. Each laser pulse has a first energy density per pulse that is greater than an ablation threshold of the dielectric layer and less than an ablation threshold of the first conductive layer. The first conductive layer is then laser drilled for a predetermined number of pulses. Each of the predetermined number of pulses has a second energy density per pulse that is greater than an ablation threshold of the first conductive layer. The predetermined number of pulses cause the surface of the first conductive layer exposed by the laser drilling to become molten.