David Allen Degree

48105635, Mar 7, 1989

Oct 30, 1987

7/114855

David C. DeGree - Burnsville MN
Herbert J. Fick - Northfield MN
Bruce H. Juenger - Northfield MN

The Bergquist Company - Minneapolis MN

B32B 1508
H05K 346

428209

A thermally conductive laminate structure for use as a mounting base and/or chassis attachment member in combination with solid-state electronic devices, the laminate preferably comprising up to five layers including a pair of outer metallic layers disposed on opposite sides of center composite layers of electrically insulative layers separated by an interposed metallic layer. The center insulative layers are films of polyimide(amide) material, with the polyimide(amide) film being filled with a quantity of aluminum oxide, boron nitride, or other suitable particulate solid in an amount ranging from between about 30% and 100% by weight of polyimide(amide) solids. The outer layers are metallic, with the base member being a metallic pad of copper or aluminum, and with the opposed metallic layer being copper and arranged in a printed circuitry pattern or array.

54635306, Oct 31, 1995

Feb 28, 1994

8/203709

David C. DeGree - Burnsville MN

The Bergquist Company - Minneapolis MN

H05K 720

361707

An apparatus for carrying semiconductor mounting devices in back-to-back arrangement is disclosed in which a central substantially planar thermally conductive support member is provided with recesses in its top and bottom surfaces of an interlocking congruent shape with the semiconductor devices to be received such that each semiconductor mounting device assembled therein is positively positioned and locked in place and fixed in a manner such that the semiconductor elements mounted on the layered or laminar elements connect directly to circuitry carried on the surfaces of the support member.

48537632, Aug 1, 1989

Dec 22, 1986

6/944947

David C. DeGree - Burnsville MN
Dallas R. Humphrey - Golden Valley MN
Carl R. Bergquist - Minnetonka MN
Roger A. West - Woodbury MN

The Bergquist Company - Minneapolis MN

H01L 2312
H01L 2314
H01L 2336

357 81

A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

46665455, May 19, 1987

Jun 27, 1984

6/625140

David C. DeGree - Burnsville MN
Carl R. Bergquist - Minnetonka MN
Dallas R. Humphrey - Golden Valley MN
Roger A. West - Woodbury MN

The Bergquist Company - Minneapolis MN

B32B 3118
F28F 700
H01B 1904

156252

A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad and flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

45748799, Mar 11, 1986

Feb 29, 1984

6/584897

David C. DeGree - Burnsville MN
Herbert J. Fick - Northfield MN
Bruce H. Juenger - Northfield MN

The Bergquist Company - Minneapolis MN

F28F 300
B32B 2520
B32B 3300
H05K 720

165185

A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.

46021256, Jul 22, 1986

May 10, 1985

6/732582

Roger A. West - Woodbury MN
Dallas R Humphrey - Golden Valley MN
Carl R. Bergquist - Minnetonka MN
David C. DeGree - Burnsville MN

The Bergquist Company - Minneapolis MN

H01B 1756
H05K 700
H01L 2314

174138G

A thermally conductive electrically insulative laminate for use as a mounting pad and electrical chassis barrier for use with solid-state electronic devices. The pad includes a number of bores with tubular projections extending outwardly therefrom for insulatively protecting the shanks of the mounting screws, bolts or other conductive materials from contact with the substrate. Additionally, the tubular projections are provided with radially extending retention burrs for mechanically holding the mounting pad in place on a substrate pending actual mounting of a semiconductor device thereon.

47552492, Jul 5, 1988

Dec 22, 1986

6/944979

David C. DeGree - Burnsville MN
Carl R. Bergquist - Minnetonka MN
Dallas R. Humphrey - Golden Valley MN
Roger A. West - Woodbury MN

The Bergquist Company - Minneapolis MN

B32B 3118
F28F 700
H01B 1904

156252

A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.