Daryl Ross Koehl

6643952, Nov 11, 2003

Nov 1, 2002

10/285898

Neal T. Murphy - Richardson TX
Claire Ching-Shan Jung - Plano TX
Daryl R. Koehl - Garland TX
Donald J. Rigsby - Garland TX

Texas Instruments Incorporated - Dallas TX

F26B 300

34445, 446486, 446491, 134 10, 134 254, 134902

A system and method are disclosed including a vapor dryer chamber ( ) with a lid ( ). A heater ( ) is disposed within the vapor dryer chamber to vaporize liquid drying medium ( ), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber ( ). Cooling coils ( ) disposed within an upper portion of the vapor drying chamber ( ) condense the drying medium vapor. A vapor monitor assembly ( ) is disposed within the vapor dryer chamber ( ) to monitor the vapor concentration within vapor dryer chamber ( ). A controller ( ) is associated with the vapor monitor assembly ( ) and evaluates vapor concentration measurements from the vapor monitor ( ).

7943489, May 17, 2011

Sep 25, 2008

12/238038

Daryl Ross Koehl - Garland TX, US
Braden Peter D'Andrea - Dallas TX, US

Texas Instruments Incorporated - Dallas TX

H01L 21/00

438460, 257E21214, 225 94, 225 96, 225 97

A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

8257985, Sep 4, 2012

Sep 25, 2008

12/238138

Clayton Lee Stevenson - Keller TX, US
Jason C. Green - Richardson TX, US
Daryl Ross Koehl - Garland TX, US
Buu Quoc Diep - Murphy TX, US

Texas Instruments Incorporated - Dallas TX

H01L 21/00

438 14, 438 51, 438113, 438458, 257E21525, 257E21238, 257E31

A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

8343805, Jan 1, 2013

Sep 4, 2012

13/603007

Clayton Lee Stevenson - Keller TX, US
Jason C. Green - Richardson TX, US
Daryl Ross Koehl - Garland TX, US
Buu Quoc Diep - Murphy TX, US

Texas Instruments Incorporated - Dallas TX

H01L 21/00

438113, 438462, 257E21525, 257E21238

A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

8530984, Sep 10, 2013

Dec 19, 2012

13/720690

Jason C. Green - Richardson TX, US
Daryl Ross Koehl - Garland TX, US
Buu Quoc Diep - Murphy TX, US

Texas Instruments Incorporated - Dallas TX

H01L 23/498
H01L 29/84

257415, 257678, 257734, 257E29324

A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

20010029683, Oct 18, 2001

Dec 14, 2000

09/737632

Neal Murphy - Richardson TX, US
Claire Jung - Plano TX, US
Daryl Koehl - Garland TX, US
Donald Rigsby - Garland TX, US

F26B003/00

034/471000, 034/072000

A system and method are disclosed including a vapor dryer chamber () with a lid (). A heater () is disposed within the vapor dryer chamber to vaporize liquid drying medium (), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber (). Cooling coils () disposed within an upper portion of the vapor drying chamber () condense the drying medium vapor. A vapor monitor assembly () is disposed within the vapor dryer chamber () to monitor the vapor concentration within vapor dryer chamber (). A controller () is associated with the vapor monitor assembly () and evaluates vapor concentration measurements from the vapor monitor ().