Search

Darrel E Coverdell

from Bigfork, MT
Age ~81
Get Report
Related to:
Chris L Hendricks, 42Nancy W CoverdellRyan Coverdell, 50Chandra L Hendricks, 46Gail G Coverdell, 74Norman W Coverdell, 77Loretta J Coverdell, 79Cory K Coverdell, 39
Connected to:
Lana R Coverdell, 61Paul H Coverdell, 53William S Coverdell, 69Bob Coverdill, 71Celeste M Coverdill, 66Sherry A Coverdill, 72Paulette F Coverick, 88Nick J Coveris, 76Cheryl A Coverly, 78David C Coverly, 60

Darrel Coverdell Phones & Addresses

  • 2850 Mt Highway 82, Bigfork, MT 59911 (406) 837-2850
  • Amanda, OH
  • Columbus, OH
  • Circleville, OH

Work

Position: Executive, Administrative, and Managerial Occupations

Education

Degree: Associate degree or higher

Publications

Us Patents

Adhesiveless Aromatic Polyimide Laminate

View page
US Patent:
55254055, Jun 11, 1996
Filed:
Dec 14, 1994
Appl. No.:
8/355467
Inventors:
Darrel E. Coverdell - Amanda OH
Harrison V. Gumm - Chillicothe OH
Mark E. McAlees - Circleville OH
Assignee:
E. I. Du Pont de Nemours and Company - Wilmington DE
International Classification:
B32B 702
B32B 2700
US Classification:
428213
Abstract:
An aromatic polyimide laminate having a thickness of at least 50 microns composed of multiple aromatic polyimide film layers containing from 400 to 10,000 ppm of tin, superimposed on and directly bonded to each other without using an adhesive. The polyimide laminates can be used in various thick film applications such as punched gaskets and washers, speaker coils, shim stock, circuit boards and machined parts.

High Modulus Polyimide Blend

View page
US Patent:
59394986, Aug 17, 1999
Filed:
Apr 7, 1998
Appl. No.:
9/056110
Inventors:
Richard Frederich Sutton - Circleville OH
Darrel Eugene Coverdell - Amanda OH
Assignee:
E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:
C08L 7700
US Classification:
525432
Abstract:
An intimate polyimide blend, prepared by chemical conversion, containing from 25 to 50 weight % of a first polyimide derived from 90 to 100 mole % of 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 0 to 10 mole % of pyromellitic dianhydride and p-phenylenediamine and from 50 to 75 weight % of a second polyimide derived from pyromellitic dianhydride, from 20 to 50 mole % of p-phenylenediamine and from 50 to 80 mole % of 4,4'-diaminodiphenylether. The polyimide blend provides blister free films having high modulus and low thermal expansion coefficients for use in electronics applications.
Control profile
Darrel E Coverdell from Bigfork, MT, age ~81 Get Report