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Daniel Waski Phones & Addresses

  • 238 Caroline Ave, Elmhurst, IL 60126 (630) 833-3651
  • 326 Church St, Elmhurst, IL 60126 (630) 833-3651
  • 7320 Gallagher Dr, Minneapolis, MN 55435 (952) 820-0366
  • 6300 York Ave, Minneapolis, MN 55435 (952) 820-0366
  • 10640 Zinran Ave, Bloomington, MN 55438 (952) 942-0734
  • Edina, MN
  • Somerset, NJ
  • Des Plaines, IL

Publications

Us Patents

Adhesive Having Insulative Properties

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US Patent:
20130160945, Jun 27, 2013
Filed:
Feb 25, 2013
Appl. No.:
13/775348
Inventors:
HENKEL CORPORATION - Rocky Hill CT, US
Robert Sandilla - Wexford PA, US
Daniel Waski - Elmhurst IL, US
Assignee:
HENKEL CORPORATION - Rocky Hill CT
International Classification:
C09J 103/02
US Classification:
156328, 521 56
Abstract:
An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.

Waterborne Adhesives For Reduced Basis Weight Multilayer Substrates And Use Thereof

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US Patent:
20220411674, Dec 29, 2022
Filed:
Aug 30, 2022
Appl. No.:
17/823294
Inventors:
- Duesseldorf, DE
Kristina Thompson - Clinton NJ, US
Daniel Waski - Elmhurst IL, US
John Meccia - Ringoes NJ, US
International Classification:
C09J 11/08
B32B 7/12
C09J 11/00
B32B 27/32
B32B 37/12
B32B 27/10
B32B 29/00
D21H 27/30
D21H 17/36
D21H 17/37
D21H 17/57
D21H 21/54
B32B 27/08
B32B 37/06
C09J 5/06
C09J 123/08
C09J 131/04
D21H 19/20
D21H 27/18
Abstract:
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Dielectric Heating Of Foamable Compositions

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US Patent:
20210214581, Jul 15, 2021
Filed:
Mar 31, 2021
Appl. No.:
17/219224
Inventors:
- Duesseldorf, DE
Alexis Kriegl - Pittstown NJ, US
Kris Getty - Deerfield IL, US
Daniel Waski - Elmhurst IL, US
Tianjian Huang - Hillsborough NJ, US
International Classification:
C09J 5/08
B32B 5/18
C08J 9/32
C08J 9/00
B31F 5/04
B32B 5/20
B32B 37/06
B32B 37/24
C09J 5/06
C09J 123/08
C09J 129/14
D21H 19/12
D21H 25/06
D21H 27/32
Abstract:
A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Waterborne Adhesives For Reduced Basis Weight Multilayer Substrates And Use Thereof

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US Patent:
20210002520, Jan 7, 2021
Filed:
Sep 18, 2020
Appl. No.:
17/025188
Inventors:
- Duesseldorf, DE
Kristina THOMPSON - Clinton NJ, US
Daniel WASKI - Elmhurst IL, US
John MECCIA - Ringoes NJ, US
International Classification:
C09J 11/08
B32B 7/12
C09J 11/00
B32B 27/32
B32B 37/12
B32B 27/10
B32B 29/00
D21H 27/30
D21H 17/36
D21H 17/37
D21H 17/57
D21H 21/54
B32B 27/08
B32B 37/06
C09J 5/06
C09J 123/08
C09J 131/04
D21H 19/20
D21H 27/18
Abstract:
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Dielectric Heating Of Foamable Compositions

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US Patent:
20190284438, Sep 19, 2019
Filed:
Mar 20, 2019
Appl. No.:
16/359190
Inventors:
- Duesseldorf, DE
Alexis Kriegl - Pittstown NJ, US
Kris Getty - Deerfield IL, US
Daniel Waski - Elmhurst IL, US
Tianjian Huang - Hillsborough NJ, US
International Classification:
C09J 5/08
C09J 5/06
B32B 5/20
C09J 129/14
C09J 123/08
D21H 27/32
B32B 37/06
B32B 37/24
B31F 5/04
D21H 19/12
D21H 25/06
Abstract:
A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Dielectric Heating Of Foamable Compositions

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US Patent:
20190218419, Jul 18, 2019
Filed:
Mar 20, 2019
Appl. No.:
16/359084
Inventors:
- Duesseldorf, DE
Alexis Kriegl - Pittstown NJ, US
Kris Getty - Deerfield IL, US
Daniel Waski - Elmhurst IL, US
Tianjian Huang - Hillsborough NJ, US
International Classification:
C09J 5/08
C09J 5/06
C09J 129/14
C09J 123/08
D21H 27/32
D21H 25/06
D21H 19/12
B31F 5/04
B32B 5/20
B32B 37/24
B32B 37/06
Abstract:
A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Waterborne Adhesives For Reduced Basis Weight Multilayer Substrates And Use Thereof

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US Patent:
20190218429, Jul 18, 2019
Filed:
Mar 20, 2019
Appl. No.:
16/359022
Inventors:
- Duesseldorf, DE
Kristina Thompson - Clinton NJ, US
Daniel Waski - Elmhurst IL, US
John Meccia - Ringoes NJ, US
International Classification:
C09J 11/08
D21H 27/18
C09J 5/06
B32B 7/12
C09J 11/00
B32B 37/12
B32B 27/10
B32B 29/00
B32B 27/32
B32B 27/08
D21H 27/30
D21H 17/36
D21H 17/37
D21H 17/57
D21H 21/54
B32B 37/06
D21H 19/20
C09J 131/04
C09J 123/08
Abstract:
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Adhesive Having Insulative Properties

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US Patent:
20190218720, Jul 18, 2019
Filed:
Mar 20, 2019
Appl. No.:
16/359139
Inventors:
- Duesseldorf, DE
Robert Sandilla - Wexford PA, US
Daniel Waski - Elmhurst IL, US
International Classification:
D21H 19/54
C09J 103/02
C08L 3/02
B31F 1/28
D21H 21/54
B31F 1/20
Abstract:
An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.
Daniel M Waski from Elmhurst, IL, age ~48 Get Report