Inventors:
Daniel P. Resler - Carlisle MA, US
William E. Hoke - Wayland MA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01L 21/20
H01L 21/36
H01L 31/20
US Classification:
438483, 438455, 257194, 257E29246
Abstract:
Described herein is a liquid crystal (LC) device having Gallium Nitride HEMT electrodes. The Gallium Nitride HEMT electrodes can be grown on a variety of substrates, including but not limited to sapphire, silicon carbide, silicon, fused silica (using a calcium fluoride buffer layer), and spinel. Also described is a structure provided from GaN HEMT grown on large area silicon substrates and transferred to another substrate with appropriate properties for OPA devices. Such substrates include, but are not limited to sapphire, silicon carbide, silicon, fused silica (using a calcium fluoride buffer layer), and spinel. The GaN HEMT structure includes an AlN interlayer for improving the mobility of the structure.