Resumes
Resumes
Daniel Buergi Phones & Addresses
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Lansdale, PA
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827 Sherrick Ct, Chalfont, PA 18914
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Buck, PA
Publications
Us Patents
Bonding Machines For Bonding Semiconductor Elements, Methods Of Operating Bonding Machines, And Techniques For Improving Uph On Such Bonding Machines
View pageUS Patent:
20170062378, Mar 2, 2017
Filed:
Aug 4, 2016
Appl. No.:
15/228083
Inventors:
- Fort Washington PA, US
Daniel P. Buergi - Chalfont PA, US
Horst Clauberg - Warwick PA, US
Matthew B. Wasserman - Philadelphia PA, US
Daniel P. Buergi - Chalfont PA, US
Horst Clauberg - Warwick PA, US
Matthew B. Wasserman - Philadelphia PA, US
International Classification:
H01L 23/00
H01L 21/683
H01L 21/683
Abstract:
A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.