Search

Dana L Graham

from San Diego, CA
Age ~46
Get Report
Also known as:
Dana L Langolf
Phone and address:
3611 Lloyd Pl, San Diego, CA 92117
(619) 415-7073
Related to:
Margaret A Langolf, 77David Langolf ReinhartAlice LangolfChristopher Worley, 38Michael Worley
Connected to:
Abra A Graham, 45Abraham W Graham, 34Adele C Graham, 71Adeline P Graham, 68Afton E Graham, 38Ahmina R Graham, 54Albert L Graham, 46Ali K Graham, 52Alia S Graham, 39Alkeem L Graham, 38

Dana Graham Phones & Addresses

  • 3611 Lloyd Pl, San Diego, CA 92117 (619) 415-7073
  • Bexley, OH
  • Fort Gratiot, MI
  • Key West, FL
  • Port Huron, MI
  • Valley Center, CA
  • East Lansing, MI
  • Encinitas, CA

Work

Company: Prudential California Realty Address: 501 Deep Valley Drive Phones: (310) 265-2141 (310) 613-1076 (310) 544-3071

Images

Specialities

Buyer's Agent • Listing Agent • Purchase Loan • Mortgage Planning

Professional Records

Real Estate Brokers

Dana Graham Photo 1

Dana Graham, Rolling Hills Est CA Realtor

View page
Specialties:
Buyer's Agent
Listing Agent
Purchase Loan
Mortgage Planning
Work:
Prudential California Realty
501 Deep Valley Drive
(310) 265-2141 (Office), (310) 613-1076 (Cell), (310) 544-3071 (Fax)
Experience:
30 years
Links:
Site
Blog

Resumes

Resumes

Dana Graham Photo 2

President, Utah Valley Sign & Led

View page
Position:
President at Utah Valley Sign & LED
Location:
Springville, Utah
Industry:
Retail
Work:
Utah Valley Sign & LED - Provo, Utah Area since Jan 2003
President
Education:
Utah Valley University
springville high school
Skills:
Sales
Marketing Strategy
Graphics
Dana Graham Photo 3

Dana Graham

View page
Location:
United States
Dana Graham Photo 4

Dana Graham

View page
Location:
Greater San Diego Area
Industry:
Wireless
Skills:
Building Relationships
Field Marketing
Operations Management
Leadership Development
Microsoft Word
Public Speaking
Training
Marketing Strategy
Customer Satisfaction
New Business Development
Management
Strategic Partnerships
Leadership
Sales Management
Direct Sales
Public Relations
Sales
Social Media Marketing
Retail
Customer Service
Customer Retention
Budgets
B2B
Contract Negotiation
Team Building
Wireless
Marketing
Dana Graham Photo 5

Dana Graham

View page
Location:
United States

Publications

Us Patents

Ldmos Transistor Heatsink Package Assembly And Manufacturing Method

View page
US Patent:
6462413, Oct 8, 2002
Filed:
Jul 21, 2000
Appl. No.:
09/620758
Inventors:
Frank J. Polese - San Diego CA
Stuart Weinshanker - La Jolla CA
Dana R. Graham - Poway CA
Assignee:
Polese Company, Inc. - San Diego CA
International Classification:
H01L 2312
US Classification:
257732, 257728, 257670, 257673, 257675
Abstract:
A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bonding. Various bonding methods are disclosed which do not compromise the die-to-flange attachment bond. A unique leadframe/spacer/flange heatsink package is also disclosed which automatically properly orients attachment of the leadframe/spacer to the flange, and provides for a thickened spacer. A unique leadframe having contact projections also avoids later wire bonding. A unique leadframe/spacer/lid combination is disclosed which allows in one step the bonding of the leadframe to the flange, electrically contacting the die, and encapsulation.

Sealing System For Hermetic Microchip Packages

View page
US Patent:
50813277, Jan 14, 1992
Filed:
Mar 28, 1990
Appl. No.:
7/500693
Inventors:
Dana R. Graham - Poway CA
Kenneth L. Jones - Escondido CA
Assignee:
Cabot Corporation - Waltham MA
International Classification:
H01L 2302
H05K 500
H05K 506
H01S 400
US Classification:
174 524
Abstract:
A sealable hermetic microchip package includes a vent therein that permits gas to escape during the sealing operation, but then itself is sealed at the completion of the sealing operation to render the package hermetic. The venting of gas from the interior of the package avoids the buildup of internal pressure during the sealing operation that can introduce bubbles and other faults into the sealing material. The vent may be a channel in the sealing surface of the lid of the package that is initially open, and then fills with the seal material as it flows to effect the seal. The vent may also be a hole in the lid that is sealed by the flow of a bead of the seal material. An equivalent approach to venting provided that the lid be mounted on standoffs that flow during sealing to permit the lid to settle onto the base of the package.
Control profile
Dana L Graham from San Diego, CA, age ~46 Get Report