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Damien S Boesch

from San Jose, CA
Age ~41
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Also known as:
Damien Seiichi Boesch
Phone and address:
210 Canmore Ct, San Jose, CA 95136
Related to:
Victoria Jeffers, 45John C Cooley, 44Richard Duke Martin, 71Lawrence M Boesch, 73Keiko S Boesch, 76Lisa N Martin, 40Gregory K Boesch, 37Richard D Martin, 72Elinor A Martin, 71Adam B Martin, 44
Connected to:
Andrew R Boesch, 40Dale C Boesch, 73Jaime L Boesch, 39Jeanne A Boesch, 62Kathy Boesch, 66Kiley M Boesch, 37Laurie K Boesch, 53Lee A Boesch, 47Mike Boesch, 77Pam Boesch, 61

Damien Boesch Phones & Addresses

  • 210 Canmore Ct, San Jose, CA 95136
  • 3149 Gavota Ave, San Jose, CA 95124
  • Mountain View, CA
  • Santa Barbara, CA

Work

Company: Samsung cheil industries 2010 Position: Research engineer

Education

School / High School: University of California, Santa Barbara 2005 to 2008

Skills

Thin Films

Industries

Nanotechnology

Resumes

Resumes

Damien Boesch Photo 1

Senior Process Engineer

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Location:
San Francisco, CA
Industry:
Nanotechnology
Work:
Samsung Cheil Industries since 2010
Research Engineer
Vitex Systems 2008 - 2010
Process Engineer
Education:
University of California, Santa Barbara 2005 - 2008
University of California, Berkeley 2001 - 2005
Bellarmine College Preparatory
Skills:
Thin Films

Publications

Us Patents

Evaporator With Internal Restriction

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US Patent:
20110154854, Jun 30, 2011
Filed:
Dec 31, 2009
Appl. No.:
12/650586
Inventors:
Damien Boesch - Mountain View CA, US
Martin Rosenblum - Menlo Park CA, US
Assignee:
VITEX SYSTEMS, INC. - San Jose CA
International Classification:
F25B 39/02
F25B 41/06
US Classification:
62524, 62527
Abstract:
An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Barrier Stacks And Methods Of Making The Same

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US Patent:
20130330531, Dec 12, 2013
Filed:
Mar 15, 2013
Appl. No.:
13/839584
Inventors:
- Uiwang-si, KR
Damien Boesch - San Jose CA, US
Xianghui Zeng - Albany CA, US
Sina Maghsoodi - San Jose CA, US
Assignee:
CHEIL INDUSTRIES, INC. - Uiwang-si
International Classification:
H01L 51/52
C23C 14/34
US Classification:
428218, 20419215, 428212
Abstract:
A barrier stack for protecting devices from the permeation of moisture and gases includes a first layer acting as a planarization, decoupling, and/or smoothing layer, a second layer acting as a plasma resistant protective layer over the first layer, and a third layer acting as a barrier layer over the second layer. The first layer includes a polymeric or organic material. The second layer includes an inorganic material or polymeric material. The third layer includes an inorganic material and has a different density and/or refractive index than the second layer. The barrier stack may further include a fourth layer acting as a tie layer between the first layer and the substrate.

Organic Light-Emitting Diode Displays With Crack Detection And Crack Propagation Prevention Circuitry

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US Patent:
20160293884, Oct 6, 2016
Filed:
Apr 8, 2015
Appl. No.:
14/681834
Inventors:
- Cupertino CA, US
Chih Jen Yang - Cupertino CA, US
Damien S. Boesch - Cupertino CA, US
Jae Won Choi - Cupertino CA, US
Paul S. Drzaic - Morgan Hill CA, US
Stephen S. Poon - San Jose CA, US
Young Bae Park - San Jose CA, US
International Classification:
H01L 51/52
H05B 33/08
G09G 3/32
H01L 27/32
H01L 51/56
Abstract:
A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.

Multilayer Encapsulation With Integrated Gas Permeation Sensor

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US Patent:
20150346050, Dec 3, 2015
Filed:
May 27, 2015
Appl. No.:
14/723442
Inventors:
- Yongin-si, KR
Damien S. Boesch - San Jose CA, US
International Classification:
G01M 3/04
H01L 51/52
Abstract:
Barrier stacks according to embodiments of the present invention provide early indication of barrier failure. In some embodiments, the barrier stack includes one or more dyads comprising a first polymer decoupling layer and a second barrier layer. The barrier stack includes one or more integrated gas permeation sensors between the first and second layers of one of the dyads, or between two of the dyads. In some embodiments, the barrier stack can include a primary barrier stack including one or more dyads, one or more integrated gas permeation sensor laterally spaced apart from the primary barrier stack, and a secondary barrier stack including one or more dyads on both the primary stack and the integrated gas permeation sensor(s).

Direct/Laminate Hybrid Encapsulation And Method Of Hybrid Encapsulation

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US Patent:
20150348803, Dec 3, 2015
Filed:
May 27, 2015
Appl. No.:
14/723366
Inventors:
- Yongin-Si, KR
Damien Boesch - San Jose CA, US
Xianghui Zeng - Albany CA, US
International Classification:
H01L 21/56
H01L 23/31
H01L 23/29
Abstract:
An encapsulated device achieves good water vapor transmission rates while reducing the amount of time needed in an inert environment, and thereby reducing the size of the deposition tool used to encapsulate the device. The encapsulated device includes a first barrier layer deposited directly on the device, and a first adhesive and first laminate on the first barrier layer. The laminate comprises a polymeric substrate and a second barrier layer on the substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in a non-inert environment. A method of making an encapsulated device comprises depositing a first barrier layer on the device in an inert environment, applying an adhesive on the first barrier layer in a non-inert environment, and applying a first laminate on the first adhesive in the non-inert environment.

Encapsulated Device Having Edge Seal And Methods Of Making The Same

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US Patent:
20150351167, Dec 3, 2015
Filed:
May 27, 2015
Appl. No.:
14/723402
Inventors:
- Yongin-si, KR
Damien S. Boesch - San Jose CA, US
Xianghui Zeng - Albany CA, US
International Classification:
H05B 33/04
H05B 33/10
Abstract:
An encapsulated device includes a barrier laminate on the device, and adhesive between the barrier laminate and the device, and an edge sealing member at an edge of the encapsulated device. The edge sealing member may be embedded in the adhesive, may enclose the adhesive between the barrier laminate and the device, or may cover an edge portion of the barrier laminate and an edge portion of the adhesive. A method of making an encapsulated device includes forming an edge sealing member by attaching it to an edge of the device, depositing it adjacent the edge of the device, or covering an edge of an encapsulated volume defined by the edge of the device with the edge sealing member. The method further includes applying an adhesive on the device, and applying a barrier laminate on the adhesive.

Encapsulation Layers With Improved Reliability

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US Patent:
20150333293, Nov 19, 2015
Filed:
May 6, 2015
Appl. No.:
14/705364
Inventors:
- Cupertino CA, US
Chih Jen Yang - Taipei, TW
Damien S. Boesch - San Jose CA, US
International Classification:
H01L 51/52
H01L 27/32
H01L 51/56
Abstract:
An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

Curable Resin Compositions And Barrier Stacks Including The Same

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US Patent:
20150252125, Sep 10, 2015
Filed:
Apr 18, 2014
Appl. No.:
14/256873
Inventors:
- Uiwang-si, KR
Damien Boesch - San Jose CA, US
Sina Maghsoodi - San Jose CA, US
International Classification:
C08F 130/08
B05D 3/06
B05D 3/02
C09D 143/04
Abstract:
A barrier stack includes a decoupling layer comprising a siloxane containing resin composition, and a barrier layer on the decoupling layer. The siloxane containing resin composition comprises a moiety derived from a siloxane monomer represented by Formula 1. A method of forming the decoupling layer includes depositing a curable resin composition comprising a siloxane monomer on the substrate, and curing the curable resin composition. The siloxane monomer of the curable resin composition includes a monomer represented by Formula 1.
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Damien S Boesch from San Jose, CA, age ~41 Get Report