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Cosimo Cantatore Phones & Addresses

  • Gilroy, CA
  • Morgan Hill, CA
  • San Jose, CA

Work

Company: Altanova Nov 2001 to Oct 2013 Position: Mechanical engineering manager

Education

Specialities: Marine Science

Skills

Project Engineering • Electronics • Engineering • Pcb Design • Testing • Ptc Creo • Lean Manufacturing • Solidworks • Six Sigma • Manufacturing • Mechanical Engineering • Design For Manufacturing • Program Management • Simulations • Electrical Engineering • Matlab • Pro Engineer • Autocad • Embedded Systems

Languages

Italian • Spanish • English

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Cosimo Cantatore Photo 1

Mechanical Engineering Manager

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Location:
3601 south Clinton Ave, South Plainfield, NJ 07080
Industry:
Electrical/Electronic Manufacturing
Work:
Altanova Nov 2001 - Oct 2013
Mechanical Engineering Manager

R&D Altanova Nov 2001 - Oct 2013
Mechanical Engineering Manager

Simovensa Feb 1999 - Aug 2000
Structure Erection Supervisor- Mechanical Inspector

John Crane Venezuela Jan 1994 - Feb 1999
Sales and Field Engineer Advisor
Education:
Universidad Metropolitana (Ve)
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Project Engineering
Electronics
Engineering
Pcb Design
Testing
Ptc Creo
Lean Manufacturing
Solidworks
Six Sigma
Manufacturing
Mechanical Engineering
Design For Manufacturing
Program Management
Simulations
Electrical Engineering
Matlab
Pro Engineer
Autocad
Embedded Systems
Languages:
Italian
Spanish
English

Publications

Us Patents

Circuit Board Stiffener

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US Patent:
7381908, Jun 3, 2008
Filed:
Jul 7, 2005
Appl. No.:
11/176903
Inventors:
Cosimo Cantatore - Morgan Hill CA, US
Mohsen H Mardi - San Jose CA, US
David M Mahoney - San Jose CA, US
International Classification:
H05K 7/02
G01R 31/02
US Classification:
174541, 174535, 324755
Abstract:
Embodiments of the present invention provide improved circuit board stiffeners. In one embodiment the present invention includes a circuit board stiffener comprising a lower stiffener piece having a first lower surface for abutting an upper surface of a test system and a first upper surface, and at least one upper stiffener piece having a second lower surface for abutting the first upper surface of the lower stiffener piece and a second upper surface for attaching to a circuit board.

Method And Structure For A 3D Wire Block

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US Patent:
20180068867, Mar 8, 2018
Filed:
Aug 28, 2017
Appl. No.:
15/688238
Inventors:
- South Plainfield NJ, US
Cosimo Cantatore - Gilroy CA, US
International Classification:
H01L 21/48
H01R 12/70
H01R 12/52
H01R 13/11
H01R 13/24
Abstract:
The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.
Cosimo P Cantatore from Gilroy, CA, age ~67 Get Report