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Conrad M Lepe

from Corona, CA
Age ~64
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Also known as:
Conrado W Lepe, Conrado M Lepe, Conrado L Lepe, Lepe Conrad
Related to:
Alberto R Padilla, 34Imelda Padilla, 37Antonio Padilla, 85Veronica Padilla, 44Gerardo Padilla, 61
Connected to:
Andy Lepe, 41Aurelio Lepe, 48Bismarck C Lepe, 45Caroline Lepe, 53Cecilio N Lepe, 52Edgar Lepe, 37Erick Lepe, 33Ignacio R Lepe, 59Isaura Lepe, 69Ismael G Lepe, 41

Conrad Lepe Phones & Addresses

  • Corona, CA
  • San Diego, CA
  • Escondido, CA
  • Chino, CA
  • El Monte, CA

Resumes

Resumes

Conrad Lepe Photo 1

Maintenance Lead Technician - Cws

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Location:
1062 Ford St, Corona, CA 92879
Industry:
Environmental Services
Work:
Zcl | Xerxes
Maintenance Lead
Aseptic Solutions Usa Aug 2012 - Aug 2017
Utilities Machanic Lead
Hewlett-Packard Feb 1996 - Jun 2005
Engineering Support Technician
Feb 1996 - Jun 2005
Maintenance Lead Technician - Cws
Education:
San Joaquin Valley College - Visalia 2015 - 2015
Palomar College 1996 - 2003
Mt. San Antonio College 1990 - 1991
Skills:
Customer Service
Management
Food
Leadership
Team Building
Continuous Improvement
Public Speaking
Food Industry
Microsoft Excel
Manufacturing
Strategic Planning
Microsoft Office
Plc Programming
Preventive Maintenance
Maintenance and Repair
Electrical Troubleshooting
Employee Training
Conrad Lepe Photo 2

Conrad Lepe

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Publications

Us Patents

Methods For Forming And Protecting Electrical Interconnects And Resultant Assemblies

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US Patent:
7338149, Mar 4, 2008
Filed:
Jun 24, 2005
Appl. No.:
11/166301
Inventors:
Mohammad Akhavain - Escondido CA, US
Joseph E. Scheffelin - Poway CA, US
Noah Lassar - San Diego CA, US
Conrad Lepe - Escondido CA, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 2/14
B41J 2/16
US Classification:
347 50, 347 58
Abstract:
The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Methods For Forming And Protecting Electrical Interconnects And Resultant Assemblies

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US Patent:
20040218009, Nov 4, 2004
Filed:
Apr 30, 2003
Appl. No.:
10/426584
Inventors:
Mohammad Akhavain - Escondido CA, US
Joseph Scheffelin - Poway CA, US
Noah Lassar - San Diego CA, US
Conrad Lepe - Escondido CA, US
International Classification:
B41J002/14
B41J002/16
US Classification:
347/050000
Abstract:
The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
Control profile
Conrad M Lepe from Corona, CA, age ~64 Get Report