Cody Blake Moody

8629360, Jan 14, 2014

Apr 30, 2012

13/460056

Brandon William Pillans - Plano TX, US
Cody Blake Moody - Frisco TX, US
Francis Joseph Morris - Dallas TX, US

Raytheon Company - Waltham MA

H01H 57/00

200181

An RF MEMS capacitive switch aligns holes in one of its electrodes to dielectric posts to reduce trapped charge without affecting the capacitance ratio of the switch. When actuated, the electrode contacts the posts' one or more contact surfaces around the plurality of holes so that each hole overlaps at least a central portion of the post to which it is aligned. By selecting the hole size such that the top electrode appears to be approximately a continuous conductive sheet at the RF frequency, the alignment of the holes to the posts reduces the amount of trapped charge without lowering switch capacitance. In different embodiments, the post diameter may be smaller than the hole diameter so that the overlap is complete, in which case trapped charge is largely eliminated.

20120062328, Mar 15, 2012

Sep 9, 2010

12/878758

Gary A. Frazier - Garland TX, US
Cody B. Moody - Frisco TX, US
Brandon W. Pillans - Plano TX, US

H03B 5/30

331154

Self powered microelectromechanical oscillators are provided for various applications. In one embodiment, the invention relates to a self powered microelectromechanical tagging or sensing system including a microelectromechanical oscillator having a characteristic frequency, the oscillator including a first substrate having a radioactive material configured to emit electrons, and a second substrate, spaced apart from the first substrate by first and second ends supported at spaced locations on the first substrate, where the second substrate includes a flexible material and is configured to collect the electrons emitted from the first substrate, and move toward the first substrate from a default position to an actuated position when a sufficient number of electrons have been collected, where, in the actuated position, a plurality of the collected electrons are transferred from the second substrate to the first substrate, and a circuitry configured to receive, from the oscillator by wireless communication, information indicative of the characteristic frequency of the oscillator.

20120319261, Dec 20, 2012

Jun 20, 2011

13/163935

Cody B. Moody - Frisco TX, US

RAYTHEON COMPANY - Waltham MA

H01L 23/02
H01L 21/50

257678, 438455, 257E21499, 257E2318

Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.

20130299328, Nov 14, 2013

May 14, 2012

13/470573

Andrew Malczewski - Richardson TX, US
Cody B. Moody - Frisco TX, US
Brandon W. Pillans - Plano TX, US

Raytheon Company - Waltham MA

H01H 9/00
H02M 3/06

200 5 R, 307109

A structure having a plurality serially coupled variable capacitors, each one of the variable capacitors having a pair of plates, one of the plates being electrostatically moveable relative to the other one of the plates, to provide each one of the variable capacitors with a variable capacitance; and a transmission line. A first one of the variable capacitors has a first one of the one plates thereof coupled between and input and output of the transmission line and a second one of the plates thereof serially coupled to a first one of the plates of a second one of the variable capacitors.

20140028113, Jan 30, 2014

Jul 24, 2012

13/556273

Francis J. Morris - Dallas TX, US
Cody B. Moody - Frisco TX, US
Andrew Malczewski - Richardson TX, US

Raytheon Company - Waltham MA

H01G 2/00

307109

A switchable capacitor having: a dielectric; a pair of electrodes, a first one of the electrodes having the dielectric thereon and a second, flexible one of the electrodes being suspended over the dielectric when the switchable capacitor is in an de-activated state; and top plate disposed between the dielectric and the second, flexible electrode and connected to a reference potential. When the switchable capacitor is electrostatically driven to an activated state, the second one of the electrodes contacts the top plate and when the switchable capacitor is returned to the de-activated state, charge on the top plate is discharged to the reference potential.

20150262967, Sep 17, 2015

Mar 6, 2015

14/640219

- Waltham MA, US
Cody B. Moody - Frisco TX, US

RAYTHEON COMPANY - Waltham MA

H01L 23/00
H01L 25/065
H01L 25/00

Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.