Clyde Ragan Phones & Addresses
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Bloomington, IN
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Weeki Wachee, FL
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Kissimmee, FL
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Kokomo, IN
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2839 1150 E, Greentown, IN 46936 (765) 628-3527
Publications
Us Patents
Method And Apparatus For Through Hole Substrate Printing
View pageUS Patent:
50809296, Jan 14, 1992
Filed:
Apr 2, 1990
Appl. No.:
7/503407
Inventors:
Joseph M. Zachman - Greentown IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
C23C 2600
US Classification:
427 97
Abstract:
A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
Method And Apparatus For Through Hole Substrate Printing
View pageUS Patent:
53225651, Jun 21, 1994
Filed:
Dec 19, 1991
Appl. No.:
7/810246
Inventors:
Joseph M. Zachman - Greentown IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
B05C 1300
US Classification:
118500
Abstract:
A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.