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Clark E Waterfall

from Sunnyvale, CA
Age ~47
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Also known as:
Waterfall E Clark
Related to:
Nicholas D Clark, 58Terry L Clark, 81Matthew T Urban, 50Patie WaterfallNicklas S Talarico, 44Ruth A Nofzinger, 73Mark W Waterfall, 75Joshua M Waterfall, 35Michelle M Waterfall, 47Margaret P WaterfallJanice E Waterfall, 75Joshua M Waterfall, 44
Connected to:
Debra P Waterfall, 67Elizabeth C Waterfall, 73Emily M Waterfall, 43Jane Waterfall, 77Rick E Waterfall, 71Robert J Waterfall, 65Allisha J Waterfield, 45Andrew T Waterfield, 42Ashley M Waterfield, 34Dean J Waterfield, 65

Clark Waterfall Phones & Addresses

  • Sunnyvale, CA
  • 505 Cypress Point Dr UNIT 85, Mountain View, CA 94043
  • 116 Hilltop Dr, Columbia City, IN 46725 (260) 244-7197
  • 6929 E Dela Balme Rd, Columbia City, IN 46725
  • Campbell, CA
  • 9465 Falcon Way, New Haven, IN 46774 (260) 804-5771
  • Fort Wayne, IN
  • 6905 E Dela Balme Rd, Columbia City, IN 46725

Work

Position: Professional/Technical

Resumes

Resumes

Clark Waterfall Photo 1

Senior Product Design Engineer

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Location:
San Francisco, CA
Industry:
Mechanical Or Industrial Engineering
Work:
Apple
Senior Product Design Engineer
Independent Feb 2012 - Jun 2012
Mechanical Engineer Consultant To Apple
Amazon Lab126 Jun 2010 - Jan 2012
Product Development Engineer
Apple Nov 2006 - May 2010
Product Development Consultant
International Truck and Engine Apr 2005 - Oct 2006
Associate Engineer
Education:
Purdue University Fort Wayne 1996 - 2002
Bachelor of Science In Mechanical Engineering, Bachelors, Mechanical Engineering
Skills:
Cad
Design For Manufacturing
Pro Engineer
Testing
Unigraphics
Product Design
Manufacturing
Engineering
Matlab
Mechanical Engineering
Finite Element Analysis
Teamcenter
Pro/Engineer
Agile
Agile Project Management
Clark Waterfall Photo 2

Clark Waterfall

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Clark Waterfall
Treasurer
Whitley County Community Foundation Inc
Individual/Family Services
400 N Whitley St, Peabody, IN 46725
PO Box 527, Peabody, IN 46725
(260) 244-5224

Publications

Us Patents

Component Retention Mechanism

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US Patent:
7995350, Aug 9, 2011
Filed:
Dec 19, 2008
Appl. No.:
12/340413
Inventors:
Vinh H. Diep - Milpitas CA, US
Giles Matthew Lowe - San Francisco CA, US
Phillip Satterfield - East Palo Alto CA, US
Clark Everett Waterfall - Campbell CA, US
Alex Chun lap Yeung - South San Francisco CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 5/00
US Classification:
361732, 361801, 361803
Abstract:
A component retention mechanism facilitates improved installation, retention and removal of hardware components (e. g. , PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

Component Retention Mechanism

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US Patent:
20110261530, Oct 27, 2011
Filed:
Jul 1, 2011
Appl. No.:
13/175673
Inventors:
Vinh H. DIEP - Milpitas CA, US
Giles Matthew LOWE - San Francisco CA, US
Phillip SATTERFIELD - East Palo Alto CA, US
Clark Everett WATERFALL - Campbell CA, US
Alex Chun lap YEUNG - South San Francisco CA, US
Assignee:
APPLE INC. - Cupertino CA
International Classification:
G06F 1/16
US Classification:
36167958
Abstract:
A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

Continous Touch Input Over Multiple Independent Surfaces

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US Patent:
20220291778, Sep 15, 2022
Filed:
Aug 2, 2021
Appl. No.:
17/444262
Inventors:
- Cupertino CA, US
Clark E. Waterfall - Mountain View CA, US
Eng Eow Goh - San Jose CA, US
Karan S. Jain - San Jose CA, US
International Classification:
G06F 3/044
G06F 3/0488
Abstract:
Touch input devices are provided with the capability of sensing a capacitive load in a two-dimensional array while also being able to sense deflection or movement of the input device in multiple different locations under an input pad. A touch input device can beneficially be used in a remote control device and can be used with multiple input buttons or platforms overlaying multiple capacitive touch input regions on a capacitive touch sensor substrate. Movement and position of a capacitive load can be tracked and calculated via output signals from a set of electrodes or other capacitance sensors with irregular shapes, with inconsistent distances from the capacitive load, and which are positioned below variable materials and material compositions. Thus, tracking gestures and taps can be detected using the capacitance sensing devices, and deflection input can be detected using switches or other actuators situated under the capacitance sensing devices.

Thermal Flow Assembly Including Integrated Fan

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US Patent:
20210059071, Feb 25, 2021
Filed:
May 5, 2020
Appl. No.:
16/867405
Inventors:
- Cupertino CA, US
Clark E. Waterfall - Campbell CA, US
Reuben J. Williams - San Francisco CA, US
Vinh H. Diep - Palo Alto CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 7/20
F28D 15/02
H01L 23/427
Abstract:
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Thermal Flow Assembly Including Integrated Fan

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US Patent:
20180324977, Nov 8, 2018
Filed:
Jul 19, 2018
Appl. No.:
16/040083
Inventors:
- Cupertino CA, US
Clark E. WATERFALL - Campbell CA, US
Reuben J. WILLIAMS - San Francisco CA, US
Vinh H. DIEP - Palo Alto CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 7/20
H01L 23/427
F28D 15/02
F28F 1/12
H01L 23/467
Abstract:
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Thermal Flow Assembly Including Integrated Fan

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US Patent:
20170094835, Mar 30, 2017
Filed:
Jun 30, 2016
Appl. No.:
15/199460
Inventors:
- Cupertino CA, US
Clark E. WATERFALL - Campbell CA, US
Reuben J. WILLIAMS - San Francisco CA, US
Vinh H. DIEP - Palo Alto CA, US
International Classification:
H05K 7/20
F28F 3/02
F28D 15/02
Abstract:
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
Control profile
Clark E Waterfall from Sunnyvale, CA, age ~47 Get Report