Inventors:
Tammy Cheng - Midland MI, US
Mark Dobrzelewski - Midland MI, US
Daniel Solomon - Midland MI, US
Christopher Windiate - Kawkawlin MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
H01L 21/56
H01L 23/29
US Classification:
438127, 257791, 257E21504, 257E2312
Abstract:
A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.