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Chinmay S Betrabet

from Corvallis, OR
Age ~63
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Also known as:
Chinmay C Betrabet, Chin May Betrabet, Sangita C Betrabet, Chinma Betrabet, Betrabet Chinmay
Phone and address:
2989 NW Acacia Pl, Corvallis, OR 97330
(541) 753-7220
Related to:
Muvia V BetrabetRishika C Betrabet, 30Sangita C Betrabet, 58Sudha S Betrabet, 89Suresh S Betrabet, 94Sachin C Betrabet, 27
Connected to:
Elizabeth W Betrand, 106Judith H Betro, 70Maria Betro, 62Michael J Betrone, 53Cecil G Betros, 74Jan Betros, 66Penny J Betros, 85Vicky L Betrosoff, 65Rachel L Betrus, 41Walter J Betsayad, 76

Chinmay Betrabet Phones & Addresses

  • 2989 NW Acacia Pl, Corvallis, OR 97330 (541) 753-7220
  • 2374 Maser Dr, Corvallis, OR 97330
  • 4012 Witham Hill Dr, Corvallis, OR 97330
  • 12438 Matinal Rd #4321, San Diego, CA 92127
  • 1537 Meadowbreeze Cir, Neenah, WI 54956
  • Pelham, NY
  • Appleton, WI
  • Blacksburg, VA
  • 12070 Avenida Sivrita, San Diego, CA 92128

Resumes

Resumes

Chinmay Betrabet Photo 1

Project Manager

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Location:
Eugene, OR
Industry:
Plastics
Work:
Willamette Valley Company
Project Manager
Saint-Gobain Performance Plastics May 2010 - Oct 2015
Senior Scientist and Research Engineer
Hp Aug 2000 - Apr 2010
Hardware Design Engineer V
Kimberly-Clark Aug 1993 - Aug 2000
Research Scientist
Tesa Tape, Inc. Jan 1986 - Dec 1989
Chemist
Education:
State University of New York College of Environmental Sciences and Forestry
Master of Science, Masters, Chemistry Indian Institute of Technology (Banaras Hindu University), Varanasi
Bachelors, Bachelor of Technology, Chemical Engineering Virginia Tech
Doctorates, Doctor of Philosophy, Engineering, Philosophy
Skills:
Design of Experiments
Product Development
Materials Science
Materials
R&D
Cross Functional Team Leadership
Semiconductors
Process Simulation
Thin Films
Manufacturing
Adhesives
Characterization
Process Engineering
Project Management
Chemistry
Polymers
Product Management
Mems
Fmea
Product Innovation
Stage Gate
Formulations
Product Architecture
Managing External Relationships
Interests:
Poverty Alleviation
Education
Environment
Health
Languages:
English
Hindi
Marathi
Konkani
Chinmay Betrabet Photo 2

Materials Technology Development

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Location:
Corvallis, OR
Industry:
Electrical/Electronic Manufacturing
Work:
Hewlett-Packard
Materials Technology Development
Chinmay Betrabet Photo 3

Chinmay Betrabet

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Chinmay Betrabet Photo 4

Chinmay Betrabet

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Chinmay Betrabet Photo 5

Materials Technology Development At Hewlett-Packard

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Position:
Materials Technology Development at Hewlett-Packard
Location:
Corvallis, Oregon Area
Industry:
Electrical/Electronic Manufacturing
Work:
Hewlett-Packard
Materials Technology Development

Publications

Us Patents

Composite And Absorbent Article Comprising Ultrasonics-Friendly Adhesive, And Method Of Making Same

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US Patent:
6541679, Apr 1, 2003
Filed:
Mar 8, 2001
Appl. No.:
09/801526
Inventors:
Chinmay Suresh Betrabet - Corvallis OR
Davis Dang Hoang Nhan - Greenville WI
Assignee:
Kimberly-Clark Worldwode, Inc. - Neenah WI
International Classification:
A61F 1315
US Classification:
604365, 60438524, 156166, 156 626
Abstract:
The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e. g. , ultrasonically bonding various components or pieces to one another. ) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas. sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0. 5.

Pad Integrity Improvement By Replacing The Constructive Adhesive With Ultrasonic Compressions

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US Patent:
6555731, Apr 29, 2003
Filed:
Dec 29, 2000
Appl. No.:
09/753231
Inventors:
Ruth A. LaChapell - Menasha WI
Chinmay S. Betrabet - Corvallis OR
Assignee:
Kimberly-Clark Worldwide, Inc. - Neenah WI
International Classification:
A61F 1315
US Classification:
604379, 156 7301, 156 91, 15658001, 60438501
Abstract:
Disposable personal care products, such as diapers, feminine care products and adult incontinence products, are provided. More specifically, disposable personal care products having improved absorbent core integrity and core absorbency are provided. These products eliminate the need for costly adhesives. A method for making the products is also provided. The method includes forming a plurality of localized compressions by ultrasonically compressing the natural fiber core between, although not necessarily adjacent to, at least one upper and at least one underlying fusible material. The periphery of the article is then bonded by conventional means, such as adhesives, crimping or fusing. This process reduces costs associated with the manufacturing of such articles by eliminating or reducing the amount of adhesives in the final product, and by eliminating costly and intermittent bonding procedures. The method also improves the continuum of the absorbent core without increasing material and manufacturing costs associated with these products.

Method And Apparatus For Reducing Adhesive Build-Up On Ultrasonic Bonding Surfaces

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US Patent:
6662992, Dec 16, 2003
Filed:
Dec 19, 2001
Appl. No.:
10/029327
Inventors:
Chinmay Suresh Betrabet - Corvallis OR
Davis Hoang Nhan - Greenville WI
Barton Andrew Laughlin - Hortonville WI
Daniel Hoo - Appleton WI
James Melvin Gaestel - Seymour WI
Assignee:
Kimberly-Clark Worldwide, Inc. - Neenah WI
International Classification:
B23K 106
US Classification:
228 11, 2281101, 228111, 134 34
Abstract:
A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.

Electronic Identification Label And Interrogator For Use Therewith

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US Patent:
7014112, Mar 21, 2006
Filed:
Apr 29, 2003
Appl. No.:
10/425789
Inventors:
John A deVos - Corvallis OR, US
Chinmay Betrabet - Corvallis OR, US
Jian-gang Weng - Corvallis OR, US
Daniel Robert Blakley - Philomath OR, US
Olan Way - Eugene OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G06K 7/08
US Classification:
235451, 235375, 235492
Abstract:
A method of conveying information from an electronic identification label to an interrogator includes coupling energy from an external field into a resonant circuit of the electronic identification label. The method also includes the electronic identification label periodically storing and discharging an amount of the coupled energy wherein the period that the electronic identification label stores and discharges the energy conveys information about the electronic identification label to the interrogator.

Composite And Absorbent Article Comprising Ultrasonics-Friendly Adhesive, And Method Of Making Same

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US Patent:
7045028, May 16, 2006
Filed:
Feb 6, 2003
Appl. No.:
10/360360
Inventors:
Chinmay Suresh Betrabet - Corvallis OR, US
Davis Dang Hoang Nhan - Greenville WI, US
Assignee:
Kimberly-Clark Wordwide, Inc. - Neenah WI
International Classification:
B32B 31/16
US Classification:
156 731, 156325
Abstract:
The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e. g. , ultrasonically bonding various components or pieces to one another. ) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Passec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0. 5.

Electronic Device

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US Patent:
7247564, Jul 24, 2007
Filed:
Jun 28, 2004
Appl. No.:
10/880299
Inventors:
Chinmay S. Betrabet - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L 21/44
US Classification:
438679, 359290
Abstract:
One embodiment of a method of making an electronic device includes forming on a substrate surface a first layer having a peak-valley-peak profile, and forming a second layer on the first layer by use of a target positioned along a line-of-sight that excludes a floor of the valley such that the second layer is not formed on the floor of said peak-valley-peak profile.

Grooved Substrate

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US Patent:
7382522, Jun 3, 2008
Filed:
Apr 29, 2005
Appl. No.:
11/118209
Inventors:
Chinmay S. Betrabet - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G02F 1/29
G02F 1/01
G02F 1/03
G02F 1/1339
G02F 1/1343
US Classification:
359316, 359245, 359254, 359279, 349139, 349140, 349141, 349143, 349153, 349156, 349110, 349114, 345 87, 313582
Abstract:
Various embodiments of a grooved substrate having electrical conductors and an electro optical material are disclosed.

Security Device

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US Patent:
7599109, Oct 6, 2009
Filed:
Jan 12, 2007
Appl. No.:
11/652706
Inventors:
David A. Champion - Lebanon OR, US
Chinmay Suresh Betrabet - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G02F 1/153
G02F 1/15
US Classification:
359275, 359265, 359273
Abstract:
Embodiments of a security device utilizing electrochromic material are disclosed.
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Chinmay S Betrabet from Corvallis, OR, age ~63 Get Report