Resumes
Resumes
Charlie Centofante Phones & Addresses
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Santa Clara, CA
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McKinney, TX
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Sunnyvale, CA
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1500 Hillview Ave, Los Altos, CA 94024 (650) 917-9950 (650) 949-0950
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Los Altos Hills, CA
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700 Ridgemark Dr, Hollister, CA 95023
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San Benito, CA
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1510 Hillview Dr, Los Altos, CA 94024
Work
Position:
Professional/Technical
Education
Degree:
Associate degree or higher
Business Records
Name / Title
Company / Classification
Phones & Addresses
Piranha Plastic LLC
Mfg Plastic Products · Plastic Injection Molding · All Other Plastics Product Manufacturing · Plastics-Mold-Manufacturers
Mfg Plastic Products · Plastic Injection Molding · All Other Plastics Product Manufacturing · Plastics-Mold-Manufacturers
PO Box 3189, Los Altos, CA 94024
3531 Thomas Rd, Santa Clara, CA 95054
1510 Hillview Dr, Los Altos, CA 94024
(408) 855-9650, (408) 855-9652
3531 Thomas Rd, Santa Clara, CA 95054
1510 Hillview Dr, Los Altos, CA 94024
(408) 855-9650, (408) 855-9652
Publications
Us Patents
Cruzcard
View pageUS Patent:
7232074, Jun 19, 2007
Filed:
Sep 30, 2004
Appl. No.:
10/954392
Inventors:
Morgan Maher - Santa Cruz CA, US
Charlie Centofante - Santa Clara CA, US
Thomas Maher - Pleasanton CA, US
Larry Maher - Fremont CA, US
Jim Jacques - Aptos CA, US
Charlie Centofante - Santa Clara CA, US
Thomas Maher - Pleasanton CA, US
Larry Maher - Fremont CA, US
Jim Jacques - Aptos CA, US
International Classification:
G06K 19/06
US Classification:
235492, 235382, 235441, 235487
Abstract:
A memory chip and embedded microprocessor (‘smart memory card’) with a sputtered memory ring for additional memory capacity. The card configuration allows use with ISO 7816 compliant readers. The smart memory card has a spring bolt-hole which allows use of the smart memory card on an adaptor with compact disc and digital video disc drives. The memory chip and sputtered memory ring have sufficient capacity for high-density memory applications such as high-level encrypted security systems, biometric identification systems, and combination access systems. The processor configuration may include a wireless transceiver for 802. 11 series, Bluetooth™ and other wireless systems.
Method For Producing Portable Memory Devices
View pageUS Patent:
7928010, Apr 19, 2011
Filed:
Oct 20, 2006
Appl. No.:
11/551402
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Assignee:
SanDisk Corporation - Milpitas CA
International Classification:
H01L 21/44
US Classification:
438674
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e. g. , test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
Portable Memory Devices
View pageUS Patent:
8013332, Sep 6, 2011
Filed:
Oct 20, 2006
Appl. No.:
11/551423
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Assignee:
SanDisk Technologies Inc. - Plano TX
International Classification:
H01L 21/66
US Classification:
257 48, 257E21001, 257E21531, 257E23001, 235492, 361737
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e. g. , test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
Portable Memory Devices
View pageUS Patent:
20110315987, Dec 29, 2011
Filed:
Sep 2, 2011
Appl. No.:
13/225263
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
International Classification:
H01L 23/495
H01L 21/66
H01L 21/66
US Classification:
257 48, 438 15, 257E23031, 257E21529
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
Method Of Manufacturing A Memory Card Package
View pageUS Patent:
54908914, Feb 13, 1996
Filed:
Dec 1, 1994
Appl. No.:
8/348535
Inventors:
Jim Farquhar - Coronado CA
Ken Dorf - San Jose CA
Brandt Weibezahn - Pleasanton CA
Iggoni Fajardo - San Jose CA
Charlie Centofante - Hollister CA
Ken Dorf - San Jose CA
Brandt Weibezahn - Pleasanton CA
Iggoni Fajardo - San Jose CA
Charlie Centofante - Hollister CA
Assignee:
Duel Systems - San Jose CA
International Classification:
B32B 3114
US Classification:
156 731
Abstract:
A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.
Pcmcia Standard Memory Card Frame
View pageUS Patent:
53978579, Mar 14, 1995
Filed:
Jul 15, 1993
Appl. No.:
8/092012
Inventors:
Jim Farquhar - Coronado CA
Charlie Centofante - Hollister CA
Ken Dorf - San Jose CA
Brandt Weibezahn - Pleasanton CA
Iggoni Fajardo - San Jose CA
Charlie Centofante - Hollister CA
Ken Dorf - San Jose CA
Brandt Weibezahn - Pleasanton CA
Iggoni Fajardo - San Jose CA
Assignee:
Dual Systems - San Jose CA
International Classification:
H05K 503
H05K 700
H05K 700
US Classification:
174 521
Abstract:
A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The frame has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.