Charles Everette Simila

20030183332, Oct 2, 2003

Mar 26, 2002

10/106545

Charles Simila - Richardson TX, US

B32B031/00

156/291000, 428/161000

The present invention relates to a method of adhering a component to a substrate with a controlled bondline, and to a device made by the method, including steps of providing a substrate; applying a first adhesive in a plurality of selected locations on a surface of the substrate; curing the first adhesive to form a plurality of structures; applying a second adhesive over selected groupings of the plurality of structures, the second adhesive at least partially surrounding and covering the structures in the selected groupings; and placing a component on the second adhesive such that the second adhesive is compressed and the component rests on the structures in at least one of the selected groupings.

49110748, Mar 27, 1990

Jun 23, 1988

7/210473

Charles E. Simila - Tucson AZ

The United States of America as represented by the Secretary of the Air
Force - Washington DC

B41F 3500
B41L 4100

101425

The cleaner utilizes a screen cleaning head carriage having a freely rotatable wiper roller, solvent ejector for directing solvent at the web before it passes over the wiper roller during motion of the head carriage in a first direction, and a drying gas ejector for directing drying gas at the screen during motion of the head carriage in a second direction opposite the first direction, together with web feed control means for advancing the web about the wiper roller in advancement increments and retracting the web about the wiper roller in lesser retraction increments interspersed with the advancement increments, to produce a two steps forward and one step back" forward intemittent web motion.

53897439, Feb 14, 1995

Dec 21, 1992

7/993544

Charles E. Simila - Tucson AZ
Mradul Mehrotra - Tucson AZ

Hughes Aircraft Company - Los Angeles CA

H05K 102

174262

A ceramic circuit card (10) for a missile utilizing a "rivet" design and a method for making the same wherein thick-film copper I/O pads (15) are fabricated on a first dielectric layer (13) and on the upper surface of conducting material (20) in vias (14) formed in the dielectric layer (13). A first conductor layer (11) is printed directly on an alumina ceramic layer (12). The dielectric layer (13) is then printed on the first conductor layer (11) and on the alumina ceramic layer (12). During operation, each I/O pad (15) has attached to it a flex harness (21) for connecting the card (10) to a printed wiring board (22) on which the card (10) is mounted. The ceramic circuit card (10) is further comprised of additional dielectric and conductor layers in an alternating stacked arrangement. The top conductor layer is used to connect the circuit card to other electrical components.

20140224781, Aug 14, 2014

Feb 11, 2013

13/764450

- Waltham MA, US
Charles E. Simila - Richardson TX, US

RAYTHEON COMPANY - Waltham MA

H05B 1/00
B68G 5/00

219201, 248118

An ergonomic armrest includes an outer surface layer formed of a pliable electrostatic discharge (ESD)-safe material. The ergonomic armrest also includes a first metal layer configured to structurally support the outer surface layer and transfer heat from a first edge of the ergonomic armrest proximate to a heat source to a second edge of the ergonomic armrest opposite the heat source. The ergonomic armrest further includes an insulating layer configured to reduce heat transfer from the heat source to the first metal layer.